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54F175DMQB Datasheet(PDF) 3 Page - Texas Instruments |
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54F175DMQB Datasheet(HTML) 3 Page - Texas Instruments |
3 / 23 page LMP91050 IN CMOUT A0 A1 GND VDD SDIO OUT CSB SCLK LMP91050 www.ti.com SNAS517D – NOVEMBER 2011 – REVISED MARCH 2013 Connection Diagram Pin Descriptions Pin Symbol Type Description 1 IN Analog Input Signal Input 2 CMOUT Analog Output Common Mode Voltage Output 3 A0 Analog Output First Stage Output 4 A1 Analog Input Second Stage Input 5 GND Power Ground Signal Output, reference to the same potential as 6 OUT Analog Output CMOUT 7 CSB Digital Input Chip Select, active low 8 SCLK Digital Input Interface Clock 9 SDIO Digital Input / Output Serial Data Input / Output 10 VDD Power Positive Supply These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) (2) ESD Tolerance(3) Human Body Model 2500V Machine Model 250V Charged Device Model 1250V Supply Voltage (VDD) –0.3V to 6.0V Voltage at Any Pin – 0.3V to VDD + 0.3V Input Current at Any Pin 5mA Storage Temperature Range -65°C to 150°C Junction Temperature(4) 150°C For soldering specifications: see product folder at www.ti.com and http://www.ti.com/lit/SNOA549. (1) “Absolute Maximum Ratings” indicate limits beyond which damage to the device may occur, including inoperability and degradation of device reliability and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or other conditions beyond those indicated in the Operating Ratings is not implied. Operating Ratings indicate conditions at which the device is functional and the device should not be operated beyond such conditions. (2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications. (3) Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of JEDEC) Field- Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC). (4) The maximum power dissipation is a function of TJ(MAX), θJA, and the ambient temperature, TA. The maximum allowable power dissipation at any ambient temperature is PDMAX = (TJ(MAX) - TA)/ θJA All numbers apply for packages soldered directly onto a PC board. Copyright © 2011–2013, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: LMP91050 |
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