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54F175DMQB Datasheet(PDF) 3 Page - Texas Instruments

Part # 54F175DMQB
Description  LMP91050 Configurable AFE for Nondispersive Infrared (NDIR) Sensing Applications
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

54F175DMQB Datasheet(HTML) 3 Page - Texas Instruments

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LMP91050
IN
CMOUT
A0
A1
GND
VDD
SDIO
OUT
CSB
SCLK
LMP91050
www.ti.com
SNAS517D – NOVEMBER 2011 – REVISED MARCH 2013
Connection Diagram
Pin Descriptions
Pin
Symbol
Type
Description
1
IN
Analog Input
Signal Input
2
CMOUT
Analog Output
Common Mode Voltage Output
3
A0
Analog Output
First Stage Output
4
A1
Analog Input
Second Stage Input
5
GND
Power
Ground
Signal Output, reference to the same potential as
6
OUT
Analog Output
CMOUT
7
CSB
Digital Input
Chip Select, active low
8
SCLK
Digital Input
Interface Clock
9
SDIO
Digital Input / Output
Serial Data Input / Output
10
VDD
Power
Positive Supply
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
(1) (2)
ESD Tolerance(3)
Human Body Model
2500V
Machine Model
250V
Charged Device Model
1250V
Supply Voltage (VDD)
–0.3V to 6.0V
Voltage at Any Pin
– 0.3V to VDD + 0.3V
Input Current at Any Pin
5mA
Storage Temperature Range
-65°C to 150°C
Junction Temperature(4)
150°C
For soldering specifications:
see product folder at www.ti.com and
http://www.ti.com/lit/SNOA549.
(1)
“Absolute Maximum Ratings” indicate limits beyond which damage to the device may occur, including inoperability and degradation of
device reliability and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or
other conditions beyond those indicated in the Operating Ratings is not implied. Operating Ratings indicate conditions at which the
device is functional and the device should not be operated beyond such conditions.
(2)
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(3)
Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of
JEDEC) Field- Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).
(4)
The maximum power dissipation is a function of TJ(MAX), θJA, and the ambient temperature, TA. The maximum allowable power
dissipation at any ambient temperature is PDMAX = (TJ(MAX) - TA)/ θJA All numbers apply for packages soldered directly onto a PC board.
Copyright © 2011–2013, Texas Instruments Incorporated
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3
Product Folder Links: LMP91050


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