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TPS56628 Datasheet(PDF) 2 Page - Texas Instruments |
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TPS56628 Datasheet(HTML) 2 Page - Texas Instruments |
2 / 23 page TPS56628 SLVSC94 – OCTOBER 2013 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ORDERING INFORMATION(1)(2)(3) TRANSPORT TA PACKAGE ORDERABLE PART NUMBER PIN MEDIA TPS56628DDA Tube –40°C to 85°C DDA 8 TPS56628DDAR Tape and Reel (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. (2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. (3) All package options have Cu NIPDAU lead/ball finish. ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range (unless otherwise noted) (1) VALUE UNIT MIN MAX VIN, EN –0.3 20 VBST –0.3 26 VBST (10 ns transient) –0.3 28 Input voltage range VBST (vs SW) –0.3 6.5 V VFB, PG –0.3 6.5 SW –2 20 SW (10 ns transient) –3 22 VREG5 –0.3 6.5 Output voltage range V GND –0.3 0.3 Voltage from GND to thermal pad, Vdiff –0.2 0.2 V Human Body Model (HBM) 2 kV Electrostatic discharge Charged Device Model (CDM) 500 V Operating junction temperature, TJ –40 150 °C Storage temperature, Tstg –55 150 (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. THERMAL INFORMATION TPS56628 THERMAL METRIC UNITS DDA (8 PINS) θJA Junction-to-ambient thermal resistance 43.5 θJCtop Junction-to-case (top) thermal resistance 49.4 θJB Junction-to-board thermal resistance 25.6 °C/W ψJT Junction-to-top characterization parameter 7.4 ψJB Junction-to-board characterization parameter 25.5 θJCbot Junction-to-case (bottom) thermal resistance 5.2 2 Copyright © 2013, Texas Instruments Incorporated Product Folder Links :TPS56628 |
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