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TPS65233 Datasheet(PDF) 5 Page - Texas Instruments |
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TPS65233 Datasheet(HTML) 5 Page - Texas Instruments |
5 / 31 page TPS65233 www.ti.com SLVSC22A – AUGUST 2013 – REVISED SEPTEMBER 2013 ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted, all voltages are with respect to GND) Voltage range at VIN, LX, BOOST, VLNB –1 to 30 V Voltage range at VCP BOOST + 7V V Voltage at LX –1 to 30 V Voltage at VCC, EN, FAULT, SCL, SDA, VCTRL, ISEL, EXTM –0.3 to 7 V Voltage at TCAP –0.3 to 3.6 V Voltage at PGND, AGND –0.3 to 0.3 V TJ Operating junction temperature range –40 to 125 °C TSTG Storage temperature range –55 to 150 °C (1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability. RECOMMENDED OPERATING CONDITIONS over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT VIN Input operating voltage 4.5 20 V TA Junction temperature –40 85 °C THERMAL INFORMATION TPS65233 THERMAL METRIC(1) RTE UNITS 16 PINS θJA Junction-to-ambient thermal resistance(2) 43.4 θJCtop Junction-to-case (top) thermal resistance(3) 45.6 θJB Junction-to-board thermal resistance(4) 15 °C/W ψJT Junction-to-top characterization parameter(5) 0.6 ψJB Junction-to-board characterization parameter(6) 15 θJCbot Junction-to-case (bottom) thermal resistance(7) 3.3 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. (2) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as specified in JESD51-7, in an environment described in JESD51-2a. (3) The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC- standard test exists, but a close description can be found in the ANSI SEMI standard G30-88. (4) The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB temperature, as described in JESD51-8. (5) The junction-to-top characterization parameter, ψJT, estimates the junction temperature of a device in a real system and is extracted from the simulation data for obtaining θJA, using a procedure described in JESD51-2a (sections 6 and 7). (6) The junction-to-board characterization parameter, ψJB, estimates the junction temperature of a device in a real system and is extracted from the simulation data for obtaining θJA , using a procedure described in JESD51-2a (sections 6 and 7). (7) The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88. Spacer ELECTROSTATIC DISCHARGE (ESD) PROTECTION MIN MAX UNIT Human body model (HBM), pin 13 (VLNB) 6000 V Human body model (HBM), other pins 2000 V Charge device model (CDM) 500 V Copyright © 2013, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: TPS65233 |
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