Thermal Pad

BOOST

VCP

VLNB

TCAP

PGND

EN/ADDR

FAULT

ISEL

1

2

3

4

16

15

14

13

9

10

11

12

TPS65233

SLVSC22A – AUGUST 2013 – REVISED SEPTEMBER 2013

www.ti.com

PIN OUT

RTE PACKAGE

(TOP VIEW)

Exposed pad must be soldered to PCB for optimal thermal performance.

TERMINAL FUNCTIONS

NAME

NO.

DESCRIPTION

LX

1

Switching node of the boost converter

VIN

2

Input of internal linear regulator

VCC

3

Internal 6.5-V power supply bias. Connect a 1-µF ceramic capacitor from this pin to ground.

AGND

4

Analog ground. Connect all ground pins and power pad together.

TCAP

5

Connect a capacitor to this pin to set the rise time and fall time of the LNB output between 13 V

and 18 V.

ISEL

6

Connect a resistor to this pin to set the LNB output current limit.

EN/ADDR

7

Enable pin to enable the whole chip; pull to ground to disable output, output will be pulled to

FAULT

8

This pin is an open drain output pin, it goes low if any fault flag is set.

SCL/VADJ

9

13 V/18 V, connect to high set output voltage 13.4 V/18.6 V.

SDA

10

VCTRL

11

Logic control pin for 13-V or 18-V voltage selection at LNB output

EXTM

12

External modulation logic input pin which activates the 22-kHz tone output, feeding signal can be

22-kHz tone or logic high or low.

VLNB

13

Output of the LNB power supply connected to satellite receiver or switch

VCP

14

Gate drive supply voltage, output of charge pump, connect a capacitor between this pin to pin

BOOST.

BOOST

15

Output of the boost regulator and input voltage of the internal linear regulator

PGND

16

Power ground for Boost Converter

Thermal PAD

Must be soldered to PCB for optimal thermal performance. Have thermal vias on the PCB to

enhance power dissipation.

4

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