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NCP59150DS18R4G Datasheet(PDF) 4 Page - ON Semiconductor |
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NCP59150DS18R4G Datasheet(HTML) 4 Page - ON Semiconductor |
4 / 14 page NCP59150, NCV59150 Series http://onsemi.com 4 ELECTRICAL CHARACTERISTICS TJ = 25C with VIN = VOUT nominal + 1 V; VEN = VIN; IL = 10 mA; bold values indicate –40C < TJ < +125C, unless noted. Parameter Conditions Min Typ Max Unit Output Voltage Accuracy DFN package IL = 10 mA −1 1 % 10 mA < IOUT < 1.5 A , VOUT nominal + 1 VIN 13.5 V −2 2 % Output Voltage Accuracy D2PAK package IL = 10 mA −1.5 1.5 % 10 mA < IOUT < 1.5 A , VOUT nominal + 1 VIN 13.5 V −2.5 2.5 % Output Voltage Line Regulation VIN = VOUT nominal + 1.0 V to 13.5 V; IL = 10 mA 0.02 0.5 % Output Voltage Load Regulation IL = 10 mA to 1.5 A 0.2 1.0 % VIN – VOUT Dropout Voltage (Note 7) IL = 750 mA 175 350 mV IL = 1.5 A 300 500 mV Ground Pin Current (Note 8) IL = 1.5 A 40 60 80 mA Ground Pin Current in Shutdown VEN v 0.5 V 1.0 5.0 mA Overload Protection Current Limit VOUT = 0 V 2.0 3.0 A Start−up Time VEN = VIN, VOUT nominal = 2.5 V, IOUT = 10 mA, COUT = 47 mF 100 500 ms Output Voltage Start−up Slope Fixed Voltage Devices VEN = VIN, IOUT = 10 mA, COUT = 47 mF (Note 9) 40 200 ms/V ENABLE INPUT Enable Input Signal Levels Regulator Enable 1.8 V Regulator Shutdown 0.8 V Enable Pin Input Current VEN v 0.8 V (Regulator Shutdown) 2.0 4.0 mA 6.5 V > VEN w 1.8 V (Regulator enable) 1.0 15 30 40 mA FLAG OUTPUT IFLG(leak) Voh = 13.5 V, Flag OFF 1.0 2.0 mA VFLG(LO) VIN = 2.24 V, IFLG = 1 mA, Flag ON 210 400 500 mV VFLG Low Threshold, % of particular VOUT 93 95 % Hysteresis, % of particular VOUT 2 % High Threshold, % of particular VOUT 97 99.2 % NCP/NCV59152 ADJ VOLTAGE DEVICES ONLY Reference Voltage DFN Package D2PAK Package 1.228 1.215 1.221 1.209 1.240 1.240 1.252 1.265 1.259 1.271 V Adjust Pin Bias Current 100 200 350 nA 7. VDO = VIN – VOUT when VOUT decreases to 98% of its nominal output voltage with VIN = VOUT + 1 V. For output voltages below 1.74 V, dropout voltage specification does not apply due to a minimum input operating voltage of 2.24 V. 8. IIN = IGND + IOUT. 9. Fixed Voltage Device Start−up Time = Output Voltage Start−up Slope * VOUT nominal. Package Conditions / PCB Footprint Thermal Resistance D2PAK–3, Junction−to−Case RqJC = 2.1C/W D2PAK–5, Junction−to−Case RqJC = 2.1C/W D2PAK–3, Junction−to−Air PCB with 100 mm2 2.0 oz Copper Heat Spreading Area RqJA = 52C/W D2PAK–5, Junction−to−Air PCB with 100 mm2 2.0 oz Copper Heat Spreading Area RqJA = 52C/W DFN8, Junction−to−Air PCB with 500 mm2 2.0 oz Copper Heat Spreading Area RqJA = 75C/W |
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