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MP2212 Datasheet(PDF) 2 Page - Monolithic Power Systems |
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MP2212 Datasheet(HTML) 2 Page - Monolithic Power Systems |
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2 / 14 page  MP2212 – 16V, 3A, 600kHz SYNCHRONOUS STEP-DOWN CONVERTER MP2212 Rev. 1.01 www.MonolithicPower.com 2 2/22/2012 MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited. © 2012 MPS. All Rights Reserved. ORDERING INFORMATION Part Number Package Top Marking Free Air Temperature (TA) MP2212DQ* QFN10 (3mm x 3mm) Z7 -40 °C to +85°C MP2212DN** SOIC8E MP2212DN -40 °C to +85°C * For Tape & Reel, add suffix –Z (e.g. MP2212DQ–Z); For RoHS compliant packaging, add suffix –LF (e.g. MP2212DQ–LF–Z) ** For Tape & Reel, add suffix –Z (e.g. MP2212DN–Z); For RoHS compliant packaging, add suffix –LF (e.g. MP2212DN–LF–Z) PACKAGE REFERENCE FB GND IN BS EN/SYNC SW SW VCC 1 2 3 4 8 7 6 5 TOP VIEW EXPOSED PAD ON BACKSIDE CONNECT TO GND QFN10 (3mm x 3mm) SOIC8E ABSOLUTE MAXIMUM RATINGS (1) IN to GND .....................................-0.3V to +18V SW to GND ........................... -0.3V to VIN + 0.3V .............................-2.5V to VIN + 2.5V for < 50ns FB, EN/SYNC, VCC to GND...........-0.3V to +6.5V BS to SW .....................................-0.3V to +6.5V Continuous Power Dissipation (TA = +25°C) (2) QFN10 (3mm x 3mm) ............... .......... ..... 2.5W SOIC8E..................................... .......... ..... 2.5W Junction Temperature...............................150°C Lead Temperature ....................................260°C Storage Temperature............... -65°C to +150°C Recommended Operating Conditions (3) Supply Voltage VIN ..............................3V to 16V Bias Voltage VCC ...................................3V to 6V EN/SYNC Voltage...................no more than VCC Output Voltage VOUT...................0.8V to 0.9x VIN Maximum Junction Temp. (TJ) ................+125°C Thermal Resistance (4) θJA θJC QFN10 (3mm x 3mm) .............50 ...... 12 ... °C/W SOIC8E...................................50 ...... 10 ... °C/W Notes: 1) Exceeding these ratings may damage the device. 2) The maximum allowable power dissipation is a function of the maximum junction temperature TJ(MAX), the junction-to- ambient thermal resistance θJA, and the ambient temperature TA. The maximum allowable continuous power dissipation at any ambient temperature is calculated by PD(MAX)=(TJ(MAX)- TA)/ θJA. Exceeding the maximum allowable power dissipation will cause excessive die temperature, and the regulator will go into thermal shutdown. Internal thermal shutdown circuitry protects the device from permanent damage. 3) The device is not guaranteed to function outside of its operating conditions. 4) Measured on JESD51-7 4-layer PCB. |
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Similar Description - MP2212 |
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