Specifications are subject to change without notice.

Customers should verify actual device performance in their specific applications.

CMF-SD Series - Telecom CPTC Resettable Fuses

CMF-SD SERIES, REV. O, 05/10

Product Dimensions

(Reduced value available on request.)

Packaging Options - Tape and Reel:

CMF-SD10, CMF-SD25, CMF-SD35 & CMF-SD50 = 400

pcs. per reel;

CMF-SD35A & CMF-SD50A = 500 pcs. per reel

A

B

F

H

G

E

D

C

Dim.

CMF-SD10

CMF-SD25

CMF-SD35

CMF-SD50

CMF-SD35A

CMF-SD50A

A

9.00

(.354)

MAX.

7.15

(.281)

MAX.

B

10.80

(.425)

MAX.

8.50

(.355)

MAX.

C

10.20

(.402)

MAX.

8.10

(.319)

MAX.

D

4.88 - 5.28

(.192 - .208)

3.25 - 3.65

(.128 - .144)

E

2.41 - 2.61

(.095 - .103)

2.41 - 2.61

(.095 - .103)

F

0.5

(.020)

MAX.

0.5

(.020)

MAX.

G

2.5

(.098)

2.5

(.098)

H

1.0

(.039)

1.0

(.039)

DIMENSIONS:

MM

(INCHES)

COPLANARITY:

0.15

(.006)

Recommended Pad Layout

B

1

2

3

4

A

F

E

D

C

H

G

1

2

3

4

Solder Reflow Recommendations

160–220

300

250

200

150

100

50

0

10–20

120

Preheating

Soldering

Cooling

Time (seconds)

Solder reflow

•

Recommended reflow methods: IR, vapor phase oven, hot air oven.

•

Devices are not designed to be wave soldered to the bottom side of the

board.

•

Gluing the devices is not recommended.

•

Recommended maximum paste thickness is 0.25 mm (.010 inch).

•

Devices can be cleaned using standard industry methods and solvents.

Note:

•

If reflow temperatures exceed the recommended profile, devices may not

meet the performance requirements.

Rework

•

A device should not be reworked.

Dim.

CMF-SD10

CMF-SD25

CMF-SD35

CMF-SD50

CMF-SD35A

CMF-SD50A

A

10.0

(.394)

8.00

(.315)

B

8.80

(.346)

7.05

(.278)

C

3.20

(.126)

2.75

(.108)

D

2.00

(.079)

2.00

(.079)

E

2.60

(.102)

2.51

(.099)

F

5.00

(.197)

3.45

(.136)

G

7.60

(.299)

5.95

(.234)

H

10.0

(.394)

8.15

(.321)

DIMENSIONS:

MM

(INCHES)

Applications

Used as a secondary overcurrent protection

device in: