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MP2676EG Datasheet(PDF) 2 Page - Monolithic Power Systems

Part # MP2676EG
Description  Li-Ion Charger Protection IC With Integrated P-MOSFET
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Manufacturer  MPS [Monolithic Power Systems]
Direct Link  http://www.monolithicpower.com
Logo MPS - Monolithic Power Systems

MP2676EG Datasheet(HTML) 2 Page - Monolithic Power Systems

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MP2676 –LI-ION CHARGER PROTECTION IC WITH INTEGRATED P-MOSFET
MP2676 Rev. 0.91
www.MonolithicPower.com
2
12/7/2010
MPS Proprietary Information. Unauthorized Photocopy and Duplication Prohibited.
© 2010 MPS. All Rights Reserved.
ORDERING INFORMATION
Part Number*
Package
Top Marking
Free Air Temperature (TA)
MP2676EG
QFN8 (2mm x 2mm)
8Q
-20
°C to +85°C
* For Tape & Reel, add suffix –Z (e.g. MP2676EG–Z)
For RoHS compliant packaging, add suffix –LF (e.g. MP2676EG–LF–Z)
PACKAGE REFERENCE
TOP VIEW
ACIN
ACIN
GND
VBAT
1
2
3
4
OUT
OUT
CHRIN
GATDRV
8
7
6
5
ABSOLUTE MAXIMUM RATINGS (1)
ACIN to GND...................................-0.3V to 30V
OUT, GATDRV and CHRIN to GND
..........................................................-0.3V to 7V
VBAT .............................................-0.3V to 5.5V
Continuous Power Dissipation
(TA = +25°C)
(2)
QFN8 (2mm x 2mm) ................................ 1.25W
Junction Temperature...............................150
°C
Storage Temperature............... -65
°C to +150°C
Lead Temperature ...................................260°C
Recommended Operating Conditions (3)
Supply Voltage VIN ..........................4.3V to 5.5V
Operating Junct. Temp (TJ)...... -20°C to +125°C
Thermal Resistance
(4)
θJA
θJC
QFN8 (2mm x 2mm).............. 100 ......55...
°C/W
Notes:
1) Exceeding these ratings may damage the device.
2) The maximum allowable power dissipation is a function of the
maximum junction temperature TJ(MAX), the junction-to-
ambient thermal resistance θJA, and the ambient temperature
TA. The maximum allowable continuous power dissipation at
any ambient temperature is calculated by PD(MAX)=(TJ(MAX)-
TA)/θJA. Exceeding the maximum allowable power dissipation
will cause excessive die temperature, and the regulator will go
into thermal shutdown. Internal thermal shutdown circuitry
protects the device from permanent damage.
3) The device is not guaranteed to function outside of its
operating conditions.
4) Measured on JESD51-7, 4-layer PCB.


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