CMZB12~CMZB53

2013-11-01

3

Marking

Abbreviation Code

Part No.

Abbreviation Code

Part No.

B12

CMZB12

B30

CMZB30

B13

CMZB13

B33

CMZB33

B15

CMZB15

B36

CMZB36

B16

CMZB16

B39

CMZB39

B18

CMZB18

B43

CMZB43

B20

CMZB20

B47

CMZB47

B22

CMZB22

B51

CMZB51

B24

CMZB24

B53

CMZB53

B27

CMZB27

Standard Soldering Pad

Handling Precaution

1) The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded,even

for a moment. Do not exceed any of these ratings. The following are the general derating methods that we

recommend when you design a circuit with a device.

P:

We recommend that the worst case power dissipation be no greater than 50% of the

absolute maximum rating of power dissipation. Carry out adequate heat design.

We recommend that a device be used within the recommended area in the figure,

Derate this rating when using a device in order to ensure high reliability.

2) Thermal resistance between junction and ambient fluctuates depending on the device’s mounting condition.

When using a device, design a circuit board and a soldering land size to match the appropriate thermal

resistance value.

3) Please refer to the Rectifiers databook for further information.

3.0

1.4

Unit: mm

1.4