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2

CPR3EW Rev. -

Cree,Inc.

4600SiliconDrive

Durham,NC27703

USATel:+1.919.313.5300

www.cree.com

CxxxTR5270M-Sxx000-3 (250-µm) Chip Diagram

Mechanical Specifications

CxxxTR5270M-Sxx000 (175-µm)

Description

Dimension

Tolerance

P-NJunctionArea(μm)

446x643

±35

ChipArea(μm)

520x700

±35

ChipThickness(μm)

175

±15

AuBondPadDiameterAnode(μm)

90

±10

AuBondPadThicknesses(μm)

1.0

±0.5

AuBondPadDiameterCathode(μm)

98

±10

BottomArea(μm)

335x515

±45

BottomContactMetal(μm)

302x482

±25

BottomContactMetalThickness(μm)

3.0

±1.0

Mechanical Specifications

CxxxTR5270M-Sxx000-3 (250-µm)

Description

Dimension

Tolerance

P-NJunctionArea(μm)

446x643

±35

ChipArea(μm)

520x700

±35

ChipThickness(μm)

250

±15

AuBondPadDiameterAnode(μm)

90

±10

AuBondPadThicknesses(μm)

1.0

±0.5

AuBondPadDiameterCathode(μm)

98

±10

BottomArea(μm)

240x420

±45

BottomContactMetal(μm)

213x392

±25

BottomContactMetalThickness(μm)

3.0

±1.0

Top View

Bottom View

Die Cross Section

Anode(+)

90-μmdiameter

TR5270MLED

520x700μm

t=250μm

BottomSurface

240x420μm

Cathode(-)

98-μmdiameter

MetalBack-Side

213x392µm