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TBU-PK085-100-WH Datasheet(PDF) 5 Page - Bourns Electronic Solutions |
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TBU-PK085-100-WH Datasheet(HTML) 5 Page - Bourns Electronic Solutions |
5 / 7 page Product Dimensions PIN 1 & BACKSIDE CHAMFER 4.00 (.157) 0.00 - 0.05 (.000 - .002) 0.80 - 0.95 (.031 - .037) 6.50 (.256) 0.85 (.033) 0.85 ± 0.05 (.033 ± .002) 0.90 (.035) 0.85 (.033) 0.30 (.012) 0.30 (.012) 1.335 (.053) 1.335 (.053) 1.275 (.050) 1.275 (.050) 0.85 (.033) 0.85 (.033) 0.85 (.033) 0.73 (.029) 1.20 (.047) 1.20 (.047) 1.35 (.053) 1.35 (.053) 0.85 (.033) 1.275 (.050) 0.725 (.029) 0.825 (.032) 0.70 (.028) 0.825 (.032) 0.40 (.016) 1.15 (.045) 1.25 (.049) 0.75 (.030) 0.75 (.030) 0.75 (.030) 1.30 (.051) C PIN 1 0.25 (.010) 0.40 (.016) 0.70 (.028) DIMENSIONS: MM (INCHES) Recommended Pad Layout 1 2 3 4 8 7 6 5 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. TBU-PK Series - TBU® High-Speed Protectors Dark grey areas show added PCB copper area for better thermal resistance. Thermal Resistance vs Additional PCB Cu Area Added Cu Area (Sq. In.) 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 120 100 80 60 40 20 0 Power in One Side of TBU® Device Total Power in Both Sides of TBU® Device TBU® High-Speed Protectors have a 100 % matte-tin termination finish. For improved thermal dissipation, the recommended layout uses PCB copper areas which extend beyond the exposed solder pad. The exposed solder pads should be defined by a solder mask which matches the pad layout of the TBU® device in size and spac- ing. It is recommended that they should be the same dimension as the TBU® pads but if smaller solder pads are used, they should be centered on the TBU® package terminal pads and not more than 0.10-0.12 mm (0.004-0.005 in.) smaller in overall width or length. Solder pad areas should not be larger than the TBU® pad sizes to ensure adequate clearance is maintained. The recommended stencil thickness is 0.10-0.12 mm (0.004-0.005 in.) with a stencil opening size 0.025 mm (0.0010 in.) less than the solder pad size. Extended copper areas beyond the solder pad significantly improve the junction to ambient thermal resistance, resulting in operation at lower junction temperatures with a corresponding benefit of reliability. All pads should soldered to the PCB, includ- ing pads marked as NC or NU but no electrical connection should be made to these pads. For minimum parasitic capacitance, it is recommended that signal, ground or power signals are not routed beneath any pad. |
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