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ZSSC3036CI1B Datasheet(PDF) 2 Page - List of Unclassifed Manufacturers

Part # ZSSC3036CI1B
Description  Low-Power, High-Resolution 16-Bit Sensor Signal Conditioner
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ZSSC3036
Low-Power 16-Bit Sensor Signal Conditioner IC
© 2013 Zentrum Mikroelektronik Dresden AG
— Rev. 1.20 — May 28, 2013. All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated,
stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
For more information, contact ZMDI via mobile.sensing@zmdi.com.
Brief Description
The ZSSC3036 is a sensor signal conditioner (SSC)
integrated circuit for high-accuracy amplification and
analog-to-digital conversion of a differential input
signal. Designed for high-resolution altimeter module
applications, the ZSSC3036 can perform offset,
span, and 1
st and 2nd order temperature compen-
sation of the measured signal. Developed for correc-
tion of resistive bridge sensors, it can also provide a
corrected temperature output measured with an
internal sensor.
The measured and corrected bridge values are
provided at the digital output pins, which can be
configured as I
2C™* (≤ 3.4MHz) or SPI (≤ 20MHz).
Digital compensation of signal offset, sensitivity,
temperature, and non-linearity is accomplished via
an 18-bit internal digital signal processor (DSP) run-
ning a correction algorithm. Calibration coefficients
are stored on-chip in a highly reliable, non-volatile,
multiple-time programmable (MTP) memory. Pro-
gramming the ZSSC3036 is simple via the serial
interface. The IC-internal charge pump provides the
MTP programming voltage. The interface is used for
the PC-controlled calibration procedure, which pro-
grams the set of calibration coefficients in memory.
The ZSSC3036 provides accelerated signal process-
ing in order to support high-speed control, safety,
and real-time sensing applications. It complements
ZMDI’s additional ZSSC30x6 products.
Features
Flexible, programmable analog front-end design;
up to 16-bit scalable, charge-balancing two-
segment analog-to-digital converter (ADC)
Fully programmable gain amplifier accepting
sensors from 14 to 72 (linear factor)
Internal auto-compensated temperature sensor
Digital compensation of individual sensor offset;
1
st and 2nd order digital compensation of sensor
gain as well as of 1
st and 2nd order temperature
gain and offset drift
Fast sensing: 16-bit conditioned sensor signal
measurement rate at more than 200s
-1
Typical sensor elements can achieve accuracy of
less than ±0.10% FSO** @ -40 to 110°C
Benefits
Integrated 18-bit calibration math DSP
Fully corrected signal at digital output
Layout customized for die-die bonding with
sensor for high-density chip-on-board assembly
One-pass calibration minimizes calibration costs
No external trimming, filter, or buffering com-
ponents required
Highly integrated CMOS design
Excellent for low-voltage and low-power battery
applications
Optimized for operation in calibrated resistive
sensor modules
Physical Characteristics
Supply voltage range: 1.8 to 3.6V
Current consumption: 1mA (operating mode)
Sleep State current: 50nA (typical)
Temperature resolution: <0.003K/LSB
Operation temperatures: –40°C to +85°C
–40°C to +110°C
Small die size: 1.5mm²
Delivery options: die for wafer bonding
* I
2C™ is a trademark of NXP.
** FSO = Full Scale Output.
ZSSC3036 Application Example


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