Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.

Should a safety concern arise regarding this product, please be sure to contact us immediately.

Metal Film Chip Resistors, Rectangular Type

Chip Resistor

a

b

Preheating

Peak

Heating

Time

Type

(inches)

Dimensions (mm)

ab

c

ERA3Y

(0603)

0.7 to 0.9

2 to 2.2

0.8 to 1

ERA6Y

(0805)

1 to 1.4

3.2 to 3.8

0.9 to 1.4

ERA14

(1210)

2 to 2.4

4.4 to 5.0

1.8 to 2.8

Temperature

Time

Preheating

140 °C to 160 °C

60 s to 120 s

Main heating

Above 200 °C

30 s to 40 s

Peak

235 ± 5 °C

max. 10 s

Temperature

Time

Preheating

150 °C to 180 °C

60 s to 120 s

Main heating

Above 230 °C

30 s to 40 s

Peak

max. 260 °C

max. 10 s

For soldering

For lead-free soldering

Temperature

TimeTemperature

Time

Preheating

140 °C to 180 °C

60 s to 120 s

150 °C to 180 °C

60 s to 120 s

Soldering

245 ± 5 °C

20 s to 30 s

max. 260 °C

max. 10 s

Recommendations and precautions are described below.

● Recommended soldering conditions for reflow

For soldering (Example : Sn/Pb)

For lead-free soldering (Example : Sn/Ag/Cu)

● Recommended soldering conditions for flow

In case of flow soldering, the land width must be smaller than the Chip Resistor width to properly control the solder amount

properly. Generally, the land width should be 0.7 to 0.8 times (W) of the width of chip resistor. In case of reflow soldering,

solder amount can be adjusted, therefore the land width should be set to 1.0 to 1.3 times chip resistor width (W).

Safety Precautions

The following are precautions for individual products. Please also refer to the precautions common to Fixed Resistors

shown on page ER3 of this catalog.

1. Keep the rated power and ambient temperature within the specified derating curve.

* When positioning and mounting Metal Film Chip Resistors (hereafter called the resistors), make allowance for the

effect of heat generated through close contact between the resistors and neighboring components and for the

temperature rise of adjacent heat-generating components.

2. If a transient load (heavy load in a short time) like a pulse is expected to be applied, check and evaluate the operations

of the resistors when installed in your products before use.

When applying pulses to the resistors, keep the pulse peak within the rated voltage.

3. Do not use halogen-based or other high-activity flux. Otherwise, the residue may impair the resistors' performance

and/or reliability.

4. When soldering with a soldering iron, never touch the resistors' bodies with the tip of the soldering iron. When using a

soldering iron with a high temperature tip, finish soldering as quickly as possible (within three seconds at 350 °C max.).

5. As the amount of applied solder becomes larger, the mechanical stress applied to the resistors increases, causing

problems such as cracks and faulty characteristics. Avoid applying an excessive amount of solder.

6. When the resistors' protective coatings are chipped, flawed, or removed, the characteristics of the resistors may be

impaired. Take special care not to apply mechanical shock during automatic mounting or cause damage during

handling of the boards with the resistors mounted.

7. Do not apply shock to the resistors or pinch them with a hard tool (e.g. pliers and tweezers). Otherwise, the resistors'

protective coatings and bodies may be chipped, affecting their performance.

8. Avoid excessive bending of printed circuit boards in order to protect the resistors from abnormal stress.

9. Do not immerse the resistors in solvent for a long time. Before using solvent, carefully check the effects of immersion.

· Reflow soldering shall be performed a maximum of

two times.

· Please contact us for additional information when

used in conditions other than those specified.

· Please measure the temperature of the terminals

and study every kind of solder and printed circuit

board for solderability before actual use.

Feb. 2006