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ECJ-CV50J106M Datasheet(PDF) 7 Page - List of Unclassifed Manufacturers |
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ECJ-CV50J106M Datasheet(HTML) 7 Page - List of Unclassifed Manufacturers |
7 / 28 page CLASSIFICATION SPECIFICATIONS No. 151S-ECJ-KGD38E PAGE SUBJECT Multilayer Ceramic Chip Capacitor Common Specifications (Class2 Large Capacitance ) DATE 23th. Apr. 2003 Note ; Table 2 No. Contents Performance Test Method Appea- rance There shall be no cracks and other mechanical damage. X5R Within ±12.5% 9 Bending Strength Capac- itance After soldering capacitor on the substrate 1mm of bending shall be applied for 5 seconds. Bending speed : 1mm/s (shown in Fig. 3) Appea- rance There shall be no cracks and other Mechanical damage. Capac- itance Shall be within the specified tolerance. 10 Vibration Proof tanδ Shall meet the specified initial value. For the class 2 Capacitors, perform the heat treatment in par. 5.1.1. Solder the specimen to the testing jig shown in Fig 2. Apply a variable vibration of 1.5mm total amplitude in the 10~55~10Hz vibration frequency range swept in 1 min. in 3 mutually perpendicular directions for 2 hours each, a total of 6 hours. Appea- rance There shall be no cracks and other Mechanical damage. Characteristic Change from the value before test. Capac- itance X5R Within ±12.5% tanδ Shall meet the specified initial value. I.R. Shall meet the specified initial value. 11 Resistance to Solder Heat With- stand voltage There shall be no dielectric breakdown or damage. (1)Solder both method Preconditioning : Heat Temperature (See 5.1.1)/Class2 Solder temperature : 270±5℃ Dipping period : 3±0.5s Preheat condition Use solder H63A(JIS-Z-3282).For the flux, use rosin (JIS-K-5902) ethanol solution of a concentration of about 25% by weight. Use tweezers for the holder to dip the specimen. Recovery : 48±4 hours (continue) 4 of 7 Period(s) Type “12” Type “13” 1 80 to 100 120 to 180 300 to 360 2 150 to 200 120 to 180 300 to 360 Order Temp. (℃) |
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