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ECJ-CV50J106M Datasheet(PDF) 7 Page - List of Unclassifed Manufacturers

Part # ECJ-CV50J106M
Description  PRODUCT SPECIFICATION FOR INFORMATION
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CLASSIFICATION
SPECIFICATIONS
No. 151S-ECJ-KGD38E
PAGE
SUBJECT
Multilayer Ceramic Chip Capacitor
Common Specifications (Class2
Large Capacitance
)
DATE
23th. Apr. 2003
Note ;
Table 2
No.
Contents
Performance
Test Method
Appea-
rance
There shall be no cracks and other
mechanical damage.
X5R
Within ±12.5%
9 Bending
Strength
Capac-
itance
After soldering capacitor on the substrate 1mm
of bending shall be applied for 5 seconds.
Bending speed : 1mm/s
(shown in Fig. 3)
Appea-
rance
There shall be no cracks and other
Mechanical damage.
Capac-
itance
Shall be within the specified tolerance.
10 Vibration
Proof
tanδ
Shall meet the specified initial value.
For the class 2 Capacitors, perform the heat
treatment in par. 5.1.1.
Solder the specimen to the testing jig shown
in Fig 2. Apply a variable vibration of 1.5mm
total amplitude in the 10~55~10Hz vibration
frequency range swept in 1 min. in 3 mutually
perpendicular directions for 2 hours each, a
total of 6 hours.
Appea-
rance
There shall be no cracks and other
Mechanical damage.
Characteristic Change from the value
before test.
Capac-
itance
X5R
Within ±12.5%
tanδ
Shall meet the specified initial value.
I.R.
Shall meet the specified initial value.
11 Resistance
to Solder
Heat
With-
stand
voltage
There shall be no dielectric breakdown
or damage.
(1)Solder both method
Preconditioning : Heat Temperature
(See 5.1.1)/Class2
Solder temperature : 270±5
Dipping period : 3±0.5s
Preheat condition
Use solder H63A(JIS-Z-3282).For the flux,
use rosin (JIS-K-5902) ethanol solution of a
concentration of about 25% by weight. Use
tweezers for the holder to dip the specimen.
Recovery : 48±4 hours
(continue)
4 of 7
Period(s)
Type
“12”
Type
“13”
80 to 100
120 to 180
300 to 360
150 to 200
120 to 180
300 to 360
Order
Temp.
(℃)


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