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ADP1607ACPZN001-R7 Datasheet(PDF) 4 Page - Analog Devices |
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ADP1607ACPZN001-R7 Datasheet(HTML) 4 Page - Analog Devices |
4 / 16 page ADP1607 Data Sheet Rev. C | Page 4 of 16 ABSOLUTE MAXIMUM RATINGS Table 2. Parameter Rating VIN, VOUT to GND −0.3 V to +3.6 V FB to GND −0.3 V to +1.4 V EN, SW to GND (when VIN ≥ VOUT) −0.3 V to VIN + 0.3 V EN, SW to GND (when VIN < VOUT) −0.3 V to VOUT + 0.3 V EPAD to GND −0.3 V to + 0.3 V Operating Ambient Temperature Range −40°C to +85°C Operating Junction Temperature Range −40°C to +90°C Storage Temperature Range −65°C to +150°C Soldering Conditions JEDEC J-STD-020 Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Absolute maximum ratings apply individually only, not in combination. THERMAL OPERATING RANGES The ADP1607 can be damaged when the junction temper- ature limits are exceeded. The maximum operating junction temperature (TJ(MAX)) takes precedence over the maximum operating ambient temperature (TA(MAX)). Monitoring ambient temperature does not guarantee that the junction temperature (TJ) is within the specified temperature limits. In applications with high power dissipation and poor PCB thermal resistance, the maximum ambient temperature may need to be derated. In applications with moderate power dissipation and low PCB thermal resistance, the maximum ambient temperature can exceed the maximum limit as long as the junction temperature is within specification limits. The junction temperature TJ of the device is dependent on the ambient temperature (TA), the power dissipation of the device (PD), and the junction-to-ambient thermal resistance of the package (θJA). Maximum junction temperature (TJ) is calculated from the ambient temperature (TA) and power dissipation (PD) using the following formula: TJ = TA + (PD × θJA) THERMAL RESISTANCE Junction-to-ambient thermal resistance (θJA) of the package is specified for the worst-case conditions, that is, a device soldered in a circuit board for surface-mount packages. The junction-to-ambient thermal resistance is highly dependent on the application and board layout. In applications where high maximum power dissipation exists, attention to thermal board design is required. The value of θJA may vary, depending on PCB material, layout, and environmental conditions. θJA and θJC (junction to case) are determined according to JESD51-9 on a 4-layer PCB with natural convection cooling and the exposed pad soldered to the board with thermal vias. Table 3. Package Type θJA θJC Unit 6-Lead LFCSP 66.06 4.3 °C/W ESD CAUTION |
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