Electronic Components Datasheet Search |
|
AMP02GBC Datasheet(PDF) 3 Page - Analog Devices |
|
AMP02GBC Datasheet(HTML) 3 Page - Analog Devices |
3 / 12 page REV. E AMP02 –3– AMP02E AMP02F Parameter Symbol Conditions Min Typ Max Min Typ Max Unit POWER SUPPLY Supply Voltage Range VS ±4.5 ±18 ±4.5 ±18 V Supply Current ISY TA = 25 °C5 6 5 6 mA –40 °C ≤ TA ≤ +85°C5 6 5 6 mA NOTES 1Input voltage range guaranteed by common-mode rejection test. 2Guaranteed by design. 3Gain tempco does not include the effects of external component drift. Specifications subject to change without notice. ABSOLUTE MAXIMUM RATINGS 1, 2 Supply Voltage ±18 V Common-Mode Input Voltage [(V–) – 60 V] to [(V+) + 60 V] Differential Input Voltage [(V–) – 60 V] to [(V+) + 60 V] Output Short-Circuit Duration Continuous Operating Temperature Range –40 °C to +85°C Storage Temperature Range –65 °C to +150°C Function Temperature Range –65 °C to +150°C Lead Temperature (Soldering, 10 sec) 300 °C Package Type JA 3 JC Unit 8-Lead Plastic DIP (P) 96 37 °C/W 16-Lead SOIC (S) 92 27 °C/W –IN +IN RG1 RG2 25k 25k 25k 25k V+ SENSE OUT REFERENCE V– Figure 2. Simplified Schematic ORDERING GUIDE VIOS max @ VOOS max @ Temperature Package Model TA = 25 CTA = 25 C Range Description AMP02EP 100 µV4 mV –40 °C to +85°C 8-Lead Plastic DIP AMP02FP 200 µV8 mV –40 °C to +85°C 8-Lead Plastic DIP AMP02AZ/883C 200 µV 10 mV –55 °C to +125°C 8-Lead CERDIP AMP02FS 200 µV8 mV –40 °C to +85°C 16-Lead SOIC AMP02GBC Die AMP02FS-REEL 200 µV8 mV –40 °C to +85°C 16-Lead SOIC NOTES 1Stresses above those listed under Absolute Maximum Ratings may cause perma- nent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those listed in the operational sections of this specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. 2Absolute maximum ratings apply to both DICE and packaged parts, unless otherwise noted. 3 θ JA is specified for worst case mounting conditions, i.e., θ JA is specified for device in socket for P-DIP package; θ JA is specified for device soldered to printed circuit board for SOIC package. |
Similar Part No. - AMP02GBC |
|
Similar Description - AMP02GBC |
|
|
Link URL |
Privacy Policy |
ALLDATASHEET.NET |
Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |