SQJ456EP

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Vishay Siliconix

S11-2288-Rev. F, 28-Nov-11

6

Document Number: 65279

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

Normalized Thermal Transient Impedance, Junction-to-Case

Note

• The characteristics shown in the two graphs

- Normalized Transient Thermal Impedance Junction-to-Ambient (25 °C)

- Normalized Transient Thermal Impedance Junction-to-Case (25 °C)

are given for general guidelines only to enable the user to get a “ball park” indication of part capabilities. The data are extracted from single

pulse transient thermal impedance characteristics which are developed from empirical measurements. The latter is valid for the part

mounted on printed circuit board - FR4, size 1" x 1" x 0.062", double sided with 2 oz. copper, 100 % on both sides. The part capabilities

can widely vary depending on actual application parameters and operating conditions.

Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon

Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and

110

2

1

0.1

0.01

0.2

0.1

Duty Cycle = 0.5

Square Wave Pulse Duration (s)

Single Pulse

0.02

0.05