DATA SHEET

HAL1xy

Micronas

April 8, 2009; DSH000150_001EN

9

2.5. Characteristics

at Recommended Operation Conditions if not otherwise specified in the column “Conditions”.

Fig. 2–3: Recommended footprint SOT89B-3, Dimensions in mm

All dimensions are for reference only. The pad size may vary depending on the requirements of the soldering process.

Symbol

Parameter

Pin No.

Min.

Typ.

Max.

Unit

Conditions

Supply Current over

Temperature Range

11.6

3

5.2

mA

Overvoltage Protection

at Supply

1

−

28.5

32

V

t = 20 ms

Overvoltage Protection at Output

3

−

28

32

V

t = 20 ms

Output Voltage over

Temperature Range

3

−

130

400

mV

Output Leakage Current over

Temperature Range

3

−−

10

µA

Output switched off,

Internal Oscillator Chopper

Frequency over Temperature

Range

−−

62

−

kHz

HAL10y, HAL 11y

−

140

−

kHz

HAL104

Enable Time of Output after

1

−

35

−

µs

Output Rise Time

3

−

75

400

ns

Output Fall Time

3

−

50

400

ns

SOT89B Package

Thermal Resistance

Junction to Ambient

Junction to Case

−

−

−

−

−

−

212

73

K/W

K/W

Measured with a 1s0p board

30 mm x 10 mm x 1.5 mm,

pad size (see Fig. 2–3)

TO92UA Package

Thermal Resistance

Junction to Ambient

Junction to Case

−

−

−

−

−

−

225

63

K/W

K/W

Measured with a 1s0p board

1.05

1.05

1.80

0.50

1.50

1.45

2.90