Light Touch Switches/EVQQX

Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.

Should a safety concern arise regarding this product, please be sure to contact us immediately.

Circuit Diagram

PWB land pattern for reference

φ3.6

6.2

±0.3

4

φ3

0.8

2

1.3

A'

B'

B

A

A

B

A'

B'

R0.3

2

1

Knob

–0.1

0

H

4

1 min.

1 min.

Even though the ground terminal is not soldered the ground effect would be gained.

However when soldering the ground terminal, do investigation sufficiently beforehand in the

invasion of the flux. We recommend to connect the GND land shown in the switch spec with

the GND of your P.W.B for withstanding electric static discharge.

✽ This land not necessary when a ground terminal is not used.

Part Numbers

Ground Terminal Operating Force

H=Height

Push Plate Color

Operating Life

EVQQXP01WWithout

1.3 N2.0 mm

White1000000 cycles

EVQQXP02WWithout

1.3 N2.5 mm

White1000000 cycles

EVQQXP03WWithout

1.3 N3.1 mm

White1000000 cycles

EVQQXS01WWithout

1.6 N2.0 mm

White1000000 cycles

EVQQXS02WWithout

1.6 N2.5 mm

White1000000 cycles

EVQQXS03WWithout

1.6 N3.1 mm

White1000000 cycles

EVQQXT01W

Without

2.6 N

2.0 mm

White

100000 cycles

EVQQXT02W

Without

2.6 N

2.5 mm

White

100000 cycles

EVQQXT03W

Without

2.6 N

3.1 mm

White

100000 cycles

EVQQXM01WWith1.3 N2.0 mm

White1000000 cycles

EVQQXM02WWith1.3 N2.5 mm

White1000000 cycles

EVQQXM03WWith1.3 N3.1 mm

White1000000 cycles

EVQQXN01WWith1.6 N2.0 mm

White1000000 cycles

EVQQXN02WWith1.6 N2.5 mm

White1000000 cycles

EVQQXN03WWith1.6 N3.1 mm

White1000000 cycles

EVQQXK01WWith2.6 N2.0 mm

White100000 cycles

EVQQXK02WWith2.6 N2.5 mm

White100000 cycles

EVQQXK03WWith2.6 N3.1 mm

White100000 cycles

EVQQX

(Embossed Taping)

With push plate

Surface mount

For reflow soldering

With ground terminal

Without ground terminal

Notes:

1. Non-washable in solvents

2. Types with ground terminal

available

Height

H

2.0±0.2

2.5±0.2

3.1

+0.3

−0.1

Jun. 2008