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W25Q32BVSSIP Datasheet(PDF) 4 Page - Winbond

Part # W25Q32BVSSIP
Description  3V 32M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
Download  78 Pages
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Manufacturer  WINBOND [Winbond]
Direct Link  http://www.winbond.com
Logo WINBOND - Winbond

W25Q32BVSSIP Datasheet(HTML) 4 Page - Winbond

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W25Q32BV
- 4 -
7.2.37
Erase Security Registers (44h)...........................................................................................58
7.2.38
Program Security Registers (42h) ......................................................................................59
7.2.39
Read Security Registers (48h) ...........................................................................................60
8.
ELECTRICAL CHARACTERISTICS .............................................................................................. 61
8.1
Absolute Maximum Ratings
(1)(2) ................................................................................... 61
8.2
Operating Ranges .............................................................................................................. 61
8.3
Power-Up Power-Down Timing and Requirements(1 ........................................................ 62
8.4
DC Electrical Characteristics.............................................................................................. 63
8.5
AC Measurement Conditions ............................................................................................. 64
8.6
AC Electrical Characteristics .............................................................................................. 65
8.7
AC Electrical Characteristics (cont’d)................................................................................. 66
8.8
Serial Output Timing........................................................................................................... 67
8.9
Serial Input Timing.............................................................................................................. 67
8.10
HOLD Timing...................................................................................................................... 67
8.11
WP Timing .......................................................................................................................... 67
9.
PACKAGE SPECIFICATION.......................................................................................................... 68
9.1
8-Pin SOIC 208-mil (Package Code SS) ........................................................................... 68
9.2
8-Pin VSOP 208-mil (Package Code ST) .......................................................................... 69
9.3
8-Pin PDIP 300-mil (Package Code DA)............................................................................ 70
9.4
8-Pad WSON 6x5-mm (Package Code ZP)....................................................................... 71
9.5
8-Pad WSON 8x6-mm (Package Code ZE)....................................................................... 72
9.6
16-Pin SOIC 300-mil (Package Code SF).......................................................................... 73
9.7
24-Ball TFBGA 8x6-mm (Package Code TB, 5x5-1 ball array) ......................................... 74
9.8
24-Ball TFBGA 8x6-mm (Package Code TC, 6x4 ball array) ............................................ 75
10.
ORDERING INFORMATION .......................................................................................................... 76
10.1
Valid Part Numbers and Top Side Marking........................................................................ 77
11.
REVISION HISTORY...................................................................................................................... 78


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