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MF-SM075 Datasheet(PDF) 3 Page - Bourns Electronic Solutions |
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MF-SM075 Datasheet(HTML) 3 Page - Bourns Electronic Solutions |
3 / 4 page Specifications are subject to change without notice. Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. Typical Time to Trip at 23 ˚C 100 1 10 0.1 0.01 0.001 0.1 1 10 100 Fault Current (Amps) MF-SM Series - PTC Resettable Fuses MF-SM SERIES, REV. Q, 11/04 Solder Reflow Recommendations 160–220 300 250 200 150 100 50 0 10–20 120 Preheating Soldering Cooling Time (seconds) Solder reflow • Recommended reflow methods: IR, vapor phase oven, hot air oven. • Devices are not designed to be wave soldered to the bottom side of the board. • Gluing the devices is not recommended. • Recommended maximum paste thickness is 0.25 mm (.010 inch). • Devices can be cleaned using standard industry methods and solvents. Note: • If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. Rework • A device should not be reworked. Typical Part Marking Represents total content. Layout may vary. MANUFACTURER'S TRADEMARK PART IDENTIFICATION 030 0A DATE CODE - WEEK 1 OF 2000 = 0A (YEAR & WEEK) WEEK 27 OF 2000 = A0 (WEEK & YEAR) |
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