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THS4031IDGNG4 Datasheet(PDF) 3 Page - Texas Instruments |
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THS4031IDGNG4 Datasheet(HTML) 3 Page - Texas Instruments |
3 / 47 page OUT 8 6 1 IN− IN+ 2 3 Null − + 1OUT 1IN− 1IN+ VCC 2OUT 2IN− 2IN+ −VCC 8 6 1 2 3 5 7 4 − + − + THS4031 THS4032 www.ti.com SLOS224G – JULY 1999 – REVISED MARCH 2010 FUNCTIONAL BLOCK DIAGRAMS Figure 1. THS4031 – Single Channel Figure 2. THS4032 – Dual Channel ABSOLUTE MAXIMUM RATINGS (1) Over operating free-air temperature range (unless otherwise noted). VALUE UNIT VCC Supply voltage, VCC+ to VCC– 33 V VI Input voltage ±VCC IO Output current 150 mA VIO Differential input voltage ±4 V Continuous total power dissipation See Dissipation Ratings Table C-suffix 0 to 70 Operating free-air TA I-suffix –40 to 85 °C temperature M-suffix –55 to 125 TJ Maximum junction temperature, (any condition) 150 °C Maximum junction temperature, continuous operation, long term reliability(2) 130 °C Tstg Storage temperature –65 to 150 °C Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 300 °C Lead temperature 1,6 mm (1/16 inch) from case for 60 seconds, JG package 300 °C Case temperature for 60 seconds, FK package 260 °C (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) The maximum junction temperature for continuous operation is limited by package constraints. Operation above this temperature may result in reduced reliability and/or lifetime of the device. Does not apply to the JG package or FK package. DISSIPATION RATINGS TABLE qJA qJC TA = 25°C, PACKAGE (°C/W) (°C/W) POWER RATING D 167(1) 38.3 629 mW, TJ = 130°C, continuous DGN(2) 58.4 4.7 1.8 W, TJ = 130°C, continuous JG 119 28 1050 mW, TJ = 150°C, continuous FK 87.7 20 1375 mW, TJ = 150°C, continuous (1) This data was taken using the JEDEC standard Low-K test PCB. For the JEDEC Proposed High-K test PCB, the qJA is 95°C/W with a power rating at TA = 25°C of 1.32 W. (2) This data was taken using 2 oz. trace and copper pad that is soldered directly to a 3-in. × 3-in. PC. For further information, refer to Application Information section of this data sheet. Copyright © 1999–2010, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Link(s): THS4031 THS4032 |
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