1

10

100

1 k

10

f − Frequency − Hz

VOLTAGE NOISE AND CURRENT NOISE

vs

FREQUENCY

20

10 k

100 k

THS4031

THS4032

SLOS224G – JULY 1999 – REVISED MARCH 2010

www.ti.com

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

PACKAGED DEVICES

NUMBER OF

EVALUATION

PLASTIC

CERAMIC DIP

CHIP CARRIER

CHANNELS

MODULE

SMALL

(JG)

(FK)

DEVICE

SYMBOL

1

THS4031CD

THS4031CDGN

TIACM

—

—

THS4031EVM

0°C to 70°C

2

THS4032CD

THS4032CDGN

TIABD

—

—

THS4032EVM

1

THS4031ID

THS4031IDGN

TIACN

—

—

—

–40°C to 85°C

2

THS4032ID

THS4032IDGN

TIABG

—

—

—

–55°C to 125°C

1

—

—

—

THS4031MJG

THS4031MFK

—

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com.

(2)

The D and DGN packages are available taped and reeled. Add an R suffix to the device type (that is, THS4031CDGNR).

(3)

The PowerPAD™ on the underside of the DGN package is electrically isolated from all other pins and active circuitry. Connection to the

PCB ground plane is recommended, although not required, as this copper plane is typically the largest copper plane on the PCB.

2

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Product Folder Link(s): THS4031 THS4032