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NCP1615CDR2G Datasheet(PDF) 6 Page - ON Semiconductor |
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NCP1615CDR2G Datasheet(HTML) 6 Page - ON Semiconductor |
6 / 44 page NCP1615 http://onsemi.com 6 Table 3. MAXIMUM RATINGS (Notes 3 and 4) Rating Pin Symbol Value Unit High Voltage Start−Up Circuit Input Voltage HV VHV −0.3 to 700 V High Voltage Feedback Input Voltage FBHV VFBHV −0.3 to 700 V High Voltage Feedback Input Current FBHV IFBHV 0.5 mA Zero Current Detection and Current Sense Input Voltage (Note 5) CS/ZCD VCS/ZCD −0.3 to VCS/ZCD(MAX) V Zero Current Detection and Current Sense Input Current CS/ZCD ICS/ZCD +5 mA Control Input Voltage (Note 6) Control VControl −0.3 to VControl(MAX) V Supply Input Voltage VCC VCC(MAX) −0.3 to 28 V Fault Input Voltage Fault VFault −0.3 to (VCC + 0.6) V PSTimer Input Voltage PSTimer VPSTimer −0.3 to (VCC + 0.6) V Driver Maximum Voltage (Note 7) DRV VDRV −0.3 to VDRV V Driver Maximum Current DRV IDRV(SRC) IDRV(SNK) 500 800 mA Maximum Input Voltage (Note 8) Other Pins VMAX −0.3 to 7 V Maximum Operating Junction Temperature TJ −40 to 150 °C Storage Temperature Range TSTG –60 to 150 °C Lead Temperature (Soldering, 10 s) TL(MAX) 300 °C Moisture Sensitivity Level MSL 1 − Power Dissipation (TA = 70°C, 1 Oz Cu, 0.155 Sq Inch Printed Circuit Copper Clad) Plastic Package SOIC−14NB/SOIC−16NB PD 465 mW Thermal Resistance, Junction to Ambient 1 Oz Cu Printed Circuit Copper Clad) Plastic Package SOIC−14NB/SOIC−16NB RqJA RqJC 172 68 °C/W ESD Capability (Note 9) Human Body Model per JEDEC Standard JESD22−A114E. Machine Model per JEDEC Standard JESD22−A114E. Charge Device Model per JEDEC Standard JESD22−C101E. > 2000 > 200 > 500 V Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. All references to Version C include Versions C/C2, unless otherwise noted. 2. All references to Version D include Versions D/D2, unless otherwise noted. 3. This device contains Latch−Up protection and exceeds ± 100 mA per JEDEC Standard JESD78. 4. Low Conductivity Board. As mounted on 80 x 100 x 1.5 mm FR4 substrate with a single layer of 50 mm2 of 2 oz copper traces and heat spreading area. As specified for a JEDEC51−1 conductivity test PCB. Test conditions were under natural convection of zero air flow. 5. VCS/ZCD(MAX) is the CS/ZCD pin positive clamp voltage. 6. VControl(MAX) is the Control pin positive clamp voltage. 7. When VCC exceeds the driver clamp voltage (VDRV(high)), VDRV is equal to VDRV(high). Otherwise, VDRV is equal to VCC. 8. When the voltage applied to these pins exceeds 5.5 V, they sink a current about equal to (Vpin − 5.5 V) / (4 kW). An applied voltage of 7 V generates a sink current of approximately 0.375 mA. 9. Pins HV, PFBHV are rated to the maximum voltage of the part, or 700 V. |
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Similar Description - NCP1615CDR2G |
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