Subject to change without notice.

www.cree.com

FEATURES

Small Chip – 230 x 230 x 85 μm

UT LED Performance

5.5 mW min. (455–475 nm) Blue

2.5 mW min. (500-510 nm) Traffic Green

2.5 mW min. (520-535 nm) Green

Low Forward Voltage

2.9–3.0 V Typical at 5 mA

Single Wire Bond Structure

Class 2 ESD Rating

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APPLICATIONS

Mobile Phone Keypads

Audio Product Display Lighting

Mobile Appliance Keypads

Automotive Applications

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UltraThin™ LEDs

CxxxUT230-S0002

superior price/performance for blue and green LEDs. These vertically structured LED chips are small in size and

require a low forward voltage. Cree’s UT™ series chips are tested for conformity to optical and electrical specifications

and the ability to withstand 1000 V ESD. Applications include keypad backlighting where sub-miniaturization and

thinner form factors are required.

CxxxUT230-S0002 Chip Diagram

Top View

Bottom View

G•SiC LED Chip

230 x 230 μm

SiC Substrate

h = 85 μm

Backside

Metallization

80 x 80 μm

Gold Bond Pad

105 μm Diameter

Die Cross Section

Cathode (-)

Anode (+)

SiC Substrate

Bottom Surface

150 x 150 μm

Mesa (junction)

176 x 176 μm

InGaN