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MCP1754ST-3302ECB Datasheet(PDF) 7 Page - Microchip Technology

Part # MCP1754ST-3302ECB
Description  150 mA, 16V, High Performance LDO
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Manufacturer  MICROCHIP [Microchip Technology]
Direct Link  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

MCP1754ST-3302ECB Datasheet(HTML) 7 Page - Microchip Technology

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© 2011 Microchip Technology Inc.
DS22276A-page 7
MCP1754/MCP1754S
PWRGD Time Delay
TPG
100
µs
Rising Edge of VOUT,
RPULLUP = 10 kΩ
Detect Threshold to
PWRGD Active Time
Delay
TVDET_PWRGD
200
µs
Falling Edge of VOUT after
Transition from
VOUT = VPRWRGD_TH + 50 mV,
to VPWRGD_TH - 50 mV,
RPULLUP = 10kΩ to VIN
AC Performance
Output Delay From VIN To
VOUT = 90% VREG
TDELAY
—240
µs
VIN = 0V to 16V, VOUT = 90%
VR,
tr (VIN)= 5V/µs,
COUT = 1 µF, SHDN = VIN
Output Delay From VIN To
VOUT > 0.1V
TDELAY_START
—80
µs
VIN = 0V to 16V, VOUT ≥ 0.1V,
tr (VIN)= 5V/µs,
COUT = 1 µF, SHDN = VIN
Output Delay From SHDN
TDELAY_SHDN
—160
µs
VIN = 16V, VOUT = 90% VR,
COUT = 1 µF, SHDN = GND to
VIN
Output Noise
eN
—3
µV/(Hz)1/2 IL = 50 mA, f = 1 kHz,
COUT = 1 µF
Power Supply Ripple
Rejection Ratio
PSRR
72
dB
VR = 5V, f = 1 kHz, IL =
150 mA,
VINAC = 1V pk-pk, CIN = 0 µF,
VIN = VR + 1.5V
Thermal Shutdown
Temperature
TSD
—150
°C
Note 6
Thermal Shutdown
Hysteresis
ΔTSD
10
°C
AC/DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise specified, all limits are established for VIN = VR + 1V, Note 1, ILOAD = 1 mA, COUT =
1 µF (X7R), CIN = 1 µF (X7R), TA = 25°C, tr(VIN) = 0.5V/µs, SHDN = VIN, PWRGD = 10K to VOUT.
Boldface type applies for junction temperatures, TJ (Note 7) of -40°C to +125°C.
Parameters
Sym
Min
Typ
Max
Units
Conditions
Note
1:
The minimum VIN must meet two conditions: VIN ≥ 3.6V and VIN ≥ VR + VDROPOUT(MAX).
2:
VR is the nominal regulator output voltage when the input voltage VIN = VRated + VDROPOUT(MAX) or ViIN = 3.6V (which-
ever is greater); IOUT = 1 mA.
3:
TCVOUT = (VOUT-HIGH - VOUT-LOW) *10
6 / (V
R * ΔTemperature), VOUT-HIGH = highest voltage measured over the
temperature range. VOUT-LOW = lowest voltage measured over the temperature range.
4:
Load regulation is measured at a constant junction temperature using low duty cycle pulse testing. Changes in output
voltage due to heating effects are determined using thermal regulation specification TCVOUT.
5:
Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal VR
measured value. The nominal VR measured value is obtained with
6:
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction
temperature and the thermal resistance from junction to air (i.e., TA, TJ, θJA). Exceeding the maximum allowable power
dissipation will cause the device operating junction temperature to exceed the maximum 150°C rating. Sustained
junction temperatures above 150°C can impact the device reliability.
7:
The junction temperature is approximated by soaking the device under test at an ambient temperature equal to the
desired Junction temperature. The test time is small enough such that the rise in the Junction temperature over the
ambient temperature is not significant.


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