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MCP1754ST-5002EDC Datasheet(PDF) 5 Page - Microchip Technology |
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MCP1754ST-5002EDC Datasheet(HTML) 5 Page - Microchip Technology |
5 / 42 page © 2011 Microchip Technology Inc. DS22276A-page 5 MCP1754/MCP1754S 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings † Input Voltage, VIN..................................................................+17.6V VIN, PWRGD, SHDN ..................... (GND-0.3V) to (VIN+0.3V) VOUT .................................................. (GND-0.3V) to (+5.5V) Internal Power Dissipation ............ Internally-Limited (Note 6) Output Short Circuit Current ................................. Continuous Storage temperature .....................................-55°C to +150°C Maximum Junction Temperature ......................165°C(Note 7) Operating Junction Temperature...................-40°C to +150°C ESD protection on all pins ..........≥ 4 kV HBM and ≥ 200V MM † Notice: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. AC/DC CHARACTERISTICS Electrical Specifications: Unless otherwise specified, all limits are established for VIN = VR + 1V, Note 1, ILOAD = 1 mA, COUT = 1 µF (X7R), CIN = 1 µF (X7R), TA = 25°C, tr(VIN) = 0.5V/µs, SHDN = VIN, PWRGD = 10K to VOUT. Boldface type applies for junction temperatures, TJ (Note 7) of -40°C to +125°C. Parameters Sym Min Typ Max Units Conditions Input / Output Characteristics Input Operating Voltage VIN 3.6 — 16.0 V Output Voltage Operating Range VOUT-RANGE 1.8 — 5.5 V Input Quiescent Current Iq —56 90 µA IL = 0 mA Input Quiescent Current for SHDN mode ISHDN —0.1 5 µA SHDN = GND Ground Current IGND —150 250 µA ILOAD = 150 mA Maximum Output Current IOUT_mA 150 —— mA Output Soft Current Limit IOUT_CL —250 — mA VIN = VIN(MIN), VOUT ≥ 0.1V, Current measured 10 ms after load is applied Output Pulse Current Limit IOUT_CL — 250 — mA Pulse Duration < 100 ms, Duty Cycle < 50%, VOUT ≥ 0.1V, Note 6 Output Short Circuit Foldback Current IOUT_SC —30 — mA VIN = VIN(MIN), VOUT = GND Output Voltage Overshoot on Startup VOVER —0.5 — %VOUT VIN = 0 to 16V, ILOAD = 150 mA Note 1: The minimum VIN must meet two conditions: VIN ≥ 3.6V and VIN ≥ VR + VDROPOUT(MAX). 2: VR is the nominal regulator output voltage when the input voltage VIN = VRated + VDROPOUT(MAX) or ViIN = 3.6V (which- ever is greater); IOUT = 1 mA. 3: TCVOUT = (VOUT-HIGH - VOUT-LOW) *10 6 / (V R * ΔTemperature), VOUT-HIGH = highest voltage measured over the temperature range. VOUT-LOW = lowest voltage measured over the temperature range. 4: Load regulation is measured at a constant junction temperature using low duty cycle pulse testing. Changes in output voltage due to heating effects are determined using thermal regulation specification TCVOUT. 5: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal VR measured value. The nominal VR measured value is obtained with 6: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, θJA). Exceeding the maximum allowable power dissipation will cause the device operating junction temperature to exceed the maximum 150°C rating. Sustained junction temperatures above 150°C can impact the device reliability. 7: The junction temperature is approximated by soaking the device under test at an ambient temperature equal to the desired Junction temperature. The test time is small enough such that the rise in the Junction temperature over the ambient temperature is not significant. |
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