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MCP1754ST-3302EMC Datasheet(PDF) 7 Page - Microchip Technology |
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MCP1754ST-3302EMC Datasheet(HTML) 7 Page - Microchip Technology |
7 / 42 page © 2011 Microchip Technology Inc. DS22276A-page 7 MCP1754/MCP1754S PWRGD Time Delay TPG — 100 — µs Rising Edge of VOUT, RPULLUP = 10 kΩ Detect Threshold to PWRGD Active Time Delay TVDET_PWRGD — 200 — µs Falling Edge of VOUT after Transition from VOUT = VPRWRGD_TH + 50 mV, to VPWRGD_TH - 50 mV, RPULLUP = 10kΩ to VIN AC Performance Output Delay From VIN To VOUT = 90% VREG TDELAY —240 — µs VIN = 0V to 16V, VOUT = 90% VR, tr (VIN)= 5V/µs, COUT = 1 µF, SHDN = VIN Output Delay From VIN To VOUT > 0.1V TDELAY_START —80 — µs VIN = 0V to 16V, VOUT ≥ 0.1V, tr (VIN)= 5V/µs, COUT = 1 µF, SHDN = VIN Output Delay From SHDN TDELAY_SHDN —160 — µs VIN = 16V, VOUT = 90% VR, COUT = 1 µF, SHDN = GND to VIN Output Noise eN —3 — µV/(Hz)1/2 IL = 50 mA, f = 1 kHz, COUT = 1 µF Power Supply Ripple Rejection Ratio PSRR — 72 — dB VR = 5V, f = 1 kHz, IL = 150 mA, VINAC = 1V pk-pk, CIN = 0 µF, VIN = VR + 1.5V Thermal Shutdown Temperature TSD —150 — °C Note 6 Thermal Shutdown Hysteresis ΔTSD — 10 — °C AC/DC CHARACTERISTICS (CONTINUED) Electrical Specifications: Unless otherwise specified, all limits are established for VIN = VR + 1V, Note 1, ILOAD = 1 mA, COUT = 1 µF (X7R), CIN = 1 µF (X7R), TA = 25°C, tr(VIN) = 0.5V/µs, SHDN = VIN, PWRGD = 10K to VOUT. Boldface type applies for junction temperatures, TJ (Note 7) of -40°C to +125°C. Parameters Sym Min Typ Max Units Conditions Note 1: The minimum VIN must meet two conditions: VIN ≥ 3.6V and VIN ≥ VR + VDROPOUT(MAX). 2: VR is the nominal regulator output voltage when the input voltage VIN = VRated + VDROPOUT(MAX) or ViIN = 3.6V (which- ever is greater); IOUT = 1 mA. 3: TCVOUT = (VOUT-HIGH - VOUT-LOW) *10 6 / (V R * ΔTemperature), VOUT-HIGH = highest voltage measured over the temperature range. VOUT-LOW = lowest voltage measured over the temperature range. 4: Load regulation is measured at a constant junction temperature using low duty cycle pulse testing. Changes in output voltage due to heating effects are determined using thermal regulation specification TCVOUT. 5: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal VR measured value. The nominal VR measured value is obtained with 6: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, θJA). Exceeding the maximum allowable power dissipation will cause the device operating junction temperature to exceed the maximum 150°C rating. Sustained junction temperatures above 150°C can impact the device reliability. 7: The junction temperature is approximated by soaking the device under test at an ambient temperature equal to the desired Junction temperature. The test time is small enough such that the rise in the Junction temperature over the ambient temperature is not significant. |
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