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CI160808_MDS Datasheet(PDF) 1 Page - Bourns Electronic Solutions |
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CI160808_MDS Datasheet(HTML) 1 Page - Bourns Electronic Solutions |
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1 / 1 page Headquarters Riverside CA www.bourns.com page 1 of 1 MATERIAL DATA SHEET Material CI160808 Series Product Line Multilayer Chip Bead Date 04-December-2004 NO. Construction element Material group Material Weight (g) Materials CAS If applicable Average mass (%) Sum (%) Traces SiO2 ------ 1 Ceramic Body Ceramic 0.0024 Al2O3 ------ Business Confidential 100 2 Terminal Terminal Electrode 0.00003 Ag 7440-22-4 1 100 3 Solder Barrier Nickel 0.00003 Ni 7440-02-0 1 4 Solder Tin 0.00003 Sn 7440-31-5 1 100 5 Circuit Silver 0.00051 Ag 7440-22-4 17 100 Total weight 0.003 |
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