L9D3256M72SBG2 datasheet(3/160 Pages) LODEV

Part #	L9D3256M72SBG2

Description	18-20 Gb, DDR3, 256 M x 72/80 Integrated Module

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Manufacturer	LODEV [LOGIC Devices Incorporated]

Direct Link	http://www.logicdevices.com

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Bank

Active

Reading

Writing

Activating

Refreshing

Self

refresh

Idle

Active

Power-

Down

ZQ

Calibration

From any

state

Power

applied

Reset

Procedure

Power

on

Initialization

MRS, MPR,

write

leveling

Preharge

Power-

Down

Writing

Automatic

Sequence

Command

Sequence

Preharging

READ

READ AP

PRE, PREA

WRITE

CKE L

WRITE

WRITE AP

PDE

PDX

SRX

SRE

REF

MRS

ACT

RESET

ZQCL

ZQCL/ZQCS

Reading

ACT = ACTIVATE

PREA=PRECHARGE ALL

SRX = Self refresh exit

MPR = Multipurpose register

READ = RD, RDS4, RDS8

WRITE = WR, WRS4, WRS8

MRS = Mode register set

READ AP = RDAP, RDAPS4, RDAPS8

WRITE AP = WRAP, WRAPS4, WRAPS8

PDE = Power-down entry

REF = REFRESH

ZQCL = ZQ LONG CALIBRATION

PDX = Power-down exit

RESET = START RESET PROCEDURE

ZQCS = ZQ SHORT CALIBRATION

PRE = PRECHARGE

SRE = Self refresh entry

LOGIC Devices Incorporated

www.logicdevices.com

3

18-20 Gb, DDR3, 256 M x 72/80 Integrated Module

L9D3256M72SBG2

PRELIMINARY INFORMATION

L9D3256M80SBG2

July 24, 2013 LDS-L9D3256MxxSBG2 Rev B

High Performance, Integrated Memory Module Product

STATE DIAGRAM

FIGURE

2 - SIMPLIFIED STATE DIAGRAM

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L9D3256M72SBG2 Datasheet(PDF) 3 Page - LOGIC Devices Incorporated

L9D3256M72SBG2 Datasheet(HTML) 3 Page - LOGIC Devices Incorporated

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