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VR25000001004KA200 Datasheet(PDF) 5 Page - Vishay Siliconix

Part # VR25000001004KA200
Description  High Ohmic/High Voltage Metal Glaze Leaded Resistors
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Manufacturer  VISHAY [Vishay Siliconix]
Direct Link  http://www.vishay.com
Logo VISHAY - Vishay Siliconix

VR25000001004KA200 Datasheet(HTML) 5 Page - Vishay Siliconix

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VR25
www.vishay.com
Vishay BCcomponents
Revision: 17-Aug-11
5
Document Number: 28732
For technical questions, contact: filmresistorsleaded@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TESTS AND REQUIREMENTS
Essentially all tests are carried out in accordance with
IEC 60115-1 specification, category LCT/UCT/56 (rated
temperature range: Lower Category Temperature, Upper
Category Temperature; damp heat, long term, 56 days).
The
tests
are
carried
out
in
accordance
with
IEC 60068-2-xx. Test method under standard atmospheric
conditions according to IEC 60068-1, 5.3.
In the Test Procedures and Requirements table the tests
and requirements are listed with reference to the relevant
clauses of IEC 60115-1 and IEC 60068-2-xx test methods.
A short description of the test procedure is also given. In
some instances deviations from the IEC recommendations
were necessary for our method of specifying.
All soldering tests are performed with mildly activated flux.
TEST PROCEDURES AND REQUIREMENTS
IEC
60115-1
CLAUSE
IEC
60068-2-
TEST
METHOD
TEST
PROCEDURE
REQUIREMENTS
4.16
Robustness of terminations:
4.16.2
21 (Ua1)
Tensile all samples
Ø 0.6 mm; load 10 N; 10 s
Number of failures < 10 x 10-6
4.16.3
21 (Ub)
Bending half number
of samples
Ø 0.6 mm; load 5 N; 4 x 90°
Number of failures < 10 x 10-6
4.16.4
21 (Uc)
Torsion other half
of samples
3 x 360° in opposite directions
No damage
R max.: ± (0.5 % R + 0.05 )
4.17
20 (Ta)
Solderability
2 s; 235 °C: Solder bath method; SnPb40
3 s; 245 °C: Solder bath method;
SnAg3Cu0.5
Good tinning (
 95 % covered);
no damage
Solderability
(after aging)
8 h steam or 16 h 155 °C;
leads immersed 6 mm;
for 2 s at 235 °C; solder bath (SnPb40)
for 3 s at 245 °C; solder bath
(SnAg3Cu0.5) method
Good tinning (
95 % covered);
no damage
4.18
20 (Tb)
Resistance to
soldering heat
Thermal shock: 10 s; 260 °C;
3 mm from body
R max.: ± (0.5 % R + 0.05 )
4.19
14 (Na)
Rapid change of temperature
30 min at - 55 °C and
30 min at + 155 °C; 5 cycles
R max.: ± (0.5 % R + 0.05 )
4.20
29 (Eb)
Bump
3 x 1500 bumps in 3 directions; 40 g
No damage
R max.: ± (0.5 % R + 0.05 )
4.22
6 (Fc)
Vibration
Frequency 10 Hz to 500 Hz; displacement
1.5 mm or acceleration 10 g; 3 directions;
total 6 h (3 x 2 h)
No damage
R max.: ± (0.5 % R + 0.05 )
4.23
Climatic sequence:
4.23.2
2 (Ba)
Dry heat
16 h; 155 °C
4.23.3
30 (Db)
Damp heat (accelerated) 1st
cycle
24 h; 55 °C; 90 % to 100 % RH
4.23.4
1 (Aa)
Cold
2 h; - 55 °C
4.23.5
13 (M)
Low air pressure
2 h; 8.5 kPa; 15 °C to 35 °C
4.23.6
30 (Db)
Damp heat (accelerated)
remaining cycles
5 days; 55 °C; 95 % to 100 % RH
Rins min.: 103 M
R max.: ± (1.5 % R + 0.1 )
4.24
78 (Cab)
Damp heat
(steady state)
56 days; 40 °C; 90 % to 95 % RH;
dissipation 0.01 P70;
limiting voltage U = 100 VDC
R max.: ± (1.5 % R + 0.1 )
4.25.1
Endurance
1000 h at 70 °C; P70 or Umax.
R max.: ± (1.5 % R + 0.1 )
4.8
Temperature coefficient
Between - 55 °C and + 155 °C
 ± 200 ppm/K
4.7
Voltage proof on insulation
URMS = 700 V during 1 min;
V-block method
No breakdown
4.12
Noise
IEC 60195
Max. 5 μV/V
4.6.1.1
Insulation resistance
U = 500 VDC during 1 min;
V-block method
Rins min.: 104 M
4.13
Short time overload
Room temperature;
dissipation 6.25 x P70 (voltage not more
than 2 x limiting voltage); 10 cycles;
5s ON and 45 s OFF
R max.: ± (2.0 % R + 0.05 )


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