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VR25000001004KA200 Datasheet(PDF) 5 Page - Vishay Siliconix |
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VR25000001004KA200 Datasheet(HTML) 5 Page - Vishay Siliconix |
5 / 7 page VR25 www.vishay.com Vishay BCcomponents Revision: 17-Aug-11 5 Document Number: 28732 For technical questions, contact: filmresistorsleaded@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TESTS AND REQUIREMENTS Essentially all tests are carried out in accordance with IEC 60115-1 specification, category LCT/UCT/56 (rated temperature range: Lower Category Temperature, Upper Category Temperature; damp heat, long term, 56 days). The tests are carried out in accordance with IEC 60068-2-xx. Test method under standard atmospheric conditions according to IEC 60068-1, 5.3. In the Test Procedures and Requirements table the tests and requirements are listed with reference to the relevant clauses of IEC 60115-1 and IEC 60068-2-xx test methods. A short description of the test procedure is also given. In some instances deviations from the IEC recommendations were necessary for our method of specifying. All soldering tests are performed with mildly activated flux. TEST PROCEDURES AND REQUIREMENTS IEC 60115-1 CLAUSE IEC 60068-2- TEST METHOD TEST PROCEDURE REQUIREMENTS 4.16 Robustness of terminations: 4.16.2 21 (Ua1) Tensile all samples Ø 0.6 mm; load 10 N; 10 s Number of failures < 10 x 10-6 4.16.3 21 (Ub) Bending half number of samples Ø 0.6 mm; load 5 N; 4 x 90° Number of failures < 10 x 10-6 4.16.4 21 (Uc) Torsion other half of samples 3 x 360° in opposite directions No damage R max.: ± (0.5 % R + 0.05 ) 4.17 20 (Ta) Solderability 2 s; 235 °C: Solder bath method; SnPb40 3 s; 245 °C: Solder bath method; SnAg3Cu0.5 Good tinning ( 95 % covered); no damage Solderability (after aging) 8 h steam or 16 h 155 °C; leads immersed 6 mm; for 2 s at 235 °C; solder bath (SnPb40) for 3 s at 245 °C; solder bath (SnAg3Cu0.5) method Good tinning ( 95 % covered); no damage 4.18 20 (Tb) Resistance to soldering heat Thermal shock: 10 s; 260 °C; 3 mm from body R max.: ± (0.5 % R + 0.05 ) 4.19 14 (Na) Rapid change of temperature 30 min at - 55 °C and 30 min at + 155 °C; 5 cycles R max.: ± (0.5 % R + 0.05 ) 4.20 29 (Eb) Bump 3 x 1500 bumps in 3 directions; 40 g No damage R max.: ± (0.5 % R + 0.05 ) 4.22 6 (Fc) Vibration Frequency 10 Hz to 500 Hz; displacement 1.5 mm or acceleration 10 g; 3 directions; total 6 h (3 x 2 h) No damage R max.: ± (0.5 % R + 0.05 ) 4.23 Climatic sequence: 4.23.2 2 (Ba) Dry heat 16 h; 155 °C 4.23.3 30 (Db) Damp heat (accelerated) 1st cycle 24 h; 55 °C; 90 % to 100 % RH 4.23.4 1 (Aa) Cold 2 h; - 55 °C 4.23.5 13 (M) Low air pressure 2 h; 8.5 kPa; 15 °C to 35 °C 4.23.6 30 (Db) Damp heat (accelerated) remaining cycles 5 days; 55 °C; 95 % to 100 % RH Rins min.: 103 M R max.: ± (1.5 % R + 0.1 ) 4.24 78 (Cab) Damp heat (steady state) 56 days; 40 °C; 90 % to 95 % RH; dissipation 0.01 P70; limiting voltage U = 100 VDC R max.: ± (1.5 % R + 0.1 ) 4.25.1 Endurance 1000 h at 70 °C; P70 or Umax. R max.: ± (1.5 % R + 0.1 ) 4.8 Temperature coefficient Between - 55 °C and + 155 °C ± 200 ppm/K 4.7 Voltage proof on insulation URMS = 700 V during 1 min; V-block method No breakdown 4.12 Noise IEC 60195 Max. 5 μV/V 4.6.1.1 Insulation resistance U = 500 VDC during 1 min; V-block method Rins min.: 104 M 4.13 Short time overload Room temperature; dissipation 6.25 x P70 (voltage not more than 2 x limiting voltage); 10 cycles; 5s ON and 45 s OFF R max.: ± (2.0 % R + 0.05 ) |
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