Board Level

Heat Sinks

All other products, please contact factory for price, delivery, and minimums.

Normally stocked

30

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS

217 SERIES

Surface Mount Heat Sinks

D

Height Above

Footprint

Thermal Performance at Typical Load

Standard

PC Board

Dimensions

Package

Package

Natural

Forced

P/N

in. (mm)

in. (mm)

Format

Quantity

Convection

Convection)

217-36CT6

.390 (9.9)

.600 (15.2) x .740 (18.8)

Bulk

1

55°C @ 1W

16.0°C/W @ 200 LFM

217-36CTT6

.390 (9.9)

.600 (15.2) x .740 (18.8)

Tube

20

55°C @ 1W

16.0°C/W @ 200 LFM

217-36CTR6

.390 (9.9)

.600 (15.2) x .740 (18.8)

Tape & Reel

250

55°C @ 1W

16.0°C/W @ 200 LFM

Material: Copper, Tin, Lead Plated

Compatible with surface mount technology (SMT) automated production techniques for ease of assembly and a

variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area,

increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'

component thermal specifications.

FEATURES AND BENEFITS:

•

No interface material is needed

• Copper with tin-lead plating for improved solderability and assembly

•

Both the component and the heat sink are installed on the PC-board utilizing

standard SMT assembly equipment for ”Tape & Reel” and “Tube” formats

• EIA standards and ESD protection are specified

•

Can be used with water soluble or no clean SMT solder creams or other pastes

REEL DETAILS

NOTES

1. Material to be “ESD”

2. Approximately 6 Meters per Reel

3. 250 Pieces per Reel.

217-36CTR6

SECTION A-A

TAPE DETAILS

217-36CT6

217 HEAT SINK WITH

DDPAK DEVICE

KEY:

Device + HS, 100 lfm

Device + HS, 300 lfm

MECHANICAL DIMENSIONS

Device Power Dissipation. W

THERMAL PERFORMANCE

6 LAYER BOARD, D' PAK

125°C LEAD, 40°C AMBIENT

Dimensions: in.