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DDC114 Datasheet(PDF) 2 Page - Texas Instruments |
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DDC114 Datasheet(HTML) 2 Page - Texas Instruments |
2 / 35 page DDC114 SBAS255C − JUNE 2004 − REVISED APRIL 2009 www.ti.com 2 PACKAGE/ORDERING INFORMATION For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. ABSOLUTE MAXIMUM RATINGS(1) Analog Input Current 750 µA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . AVDD to DVDD −0.3V to +6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . AVDD to AGND −0.3V to +6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DVDD to DGND −0.3V to +6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . AGND to DGND ±0.2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VREF Input to AGND 2.0V to AVDD + 0.3V . . . . . . . . . . . . . . . . . . Analog Input to AGND −0.3V to +0.7V . . . . . . . . . . . . . . . . . . . . . . . Digital Input Voltage to DGND −0.3V to DVDD + 0.3V . . . . . . . . . . . Digital Output Voltage to DGND −0.3V to AVDD + 0.3V . . . . . . . . . Operating Temperature −40 °C to +85°C . . . . . . . . . . . . . . . . . . . . . . . Storage Temperature −60 °C to +150°C . . . . . . . . . . . . . . . . . . . . . . . . Junction Temperature (TJ) +150 °C . . . . . . . . . . . . . . . . . . . . . . . . . . . (1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied. This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. |
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