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ASM3106C-1 Datasheet(PDF) 6 Page - Aplus Intergrated Circuits |
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ASM3106C-1 Datasheet(HTML) 6 Page - Aplus Intergrated Circuits |
6 / 7 page 1.4 Bonding Diagram ASM3106C 96K x 10 bit ROM 6 7 8 9 5 4 1 2 3 10 11 CHIP SIZE: X= 1550+80(um) , Y= 2170+80(um) Substrate must be connected to GND. ASM3106C Pad Location Chip Size: X= 1550 + 80 (um), Y=2170 + 80 (um) PAD # PAD Name X Y PAD # PAD Name X Y 1 RA3 -664.92 -676.8 7 TEST 105.44 -1001.48 2 RA2 -664.92 -804.92 8 COUT 303.96 -1001.48 3 RA1 -662.64 -1001.48 9 VDD 683.04 -1001.48 4 RA0 -468.24 -1001.48 10 RB0 664.92 -805.28 5 OSC -281.04 -1001.48 11 RB1 664.92 -682.08 6 GND -111.72 -1001.48 5 ASM3106C X= 1550+80(um) Y= 2170+80(um) |
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Similar Description - ASM3106C-1 |
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