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LM4050CEM3-5.0 Datasheet(PDF) 2 Page - Texas Instruments |
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LM4050CEM3-5.0 Datasheet(HTML) 2 Page - Texas Instruments |
2 / 35 page LM4050-N, LM4050-N-Q1 SNOS455E – MAY 2000 – REVISED APRIL 2013 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) (2) Reverse Current 20 mA Forward Current 10 mA Power Dissipation (TA = 25°C) (3) DBZ Package 280 mW Storage Temperature −65°C to +150°C Vapor phase (60 seconds) +215°C Lead Temperature DBZ Package Infrared (15 seconds) +220°C Human Body Model(4) 2 kV ESD Susceptibility Machine Model(4) 200V See AN-450 “Surface Mounting Methods and Their Effect on Product Reliability” for other methods of soldering surface mount devices. (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions. (2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications. (3) The maximum power dissipation must be derated at elevated temperatures and is dictated by TJmax (maximum junction temperature), θJA (junction to ambient thermal resistance), and TA (ambient temperature). The maximum allowable power dissipation at any temperature is PDmax = (TJmax − TA)/θJA or the number given in the Absolute Maximum Ratings, whichever is lower. For the LM4050-N, TJmax = 125°C, and the typical thermal resistance (θJA), when board mounted, is 326°C/W for the SOT-23 package. (4) The human body model is a 100 pF capacitor discharged through a 1.5 k Ω resistor into each pin. The machine model is a 200 pF capacitor discharged directly into each pin. Operating Ratings (1) Temperature Range (Tmin ≤ TA ≤ Tmax) Industrial Temperature Range −40°C ≤ TA ≤ +85°C Extended temperature Range −40°C ≤ TA ≤ +125°C LM4050-N-2.0, 60 μA to 15 mA LM4050-N-2.5 60 μA to 15 mA LM4050-N-4.1 68 μA to 15 mA Reverse Current LM4050-N-5.0 74 μA to 15 mA LM4050-N-8.2 91 μA to 15 mA LM4050-N-10.0 100 μA to 15 mA (1) The maximum power dissipation must be derated at elevated temperatures and is dictated by TJmax (maximum junction temperature), θJA (junction to ambient thermal resistance), and TA (ambient temperature). The maximum allowable power dissipation at any temperature is PDmax = (TJmax − TA)/θJA or the number given in the Absolute Maximum Ratings, whichever is lower. For the LM4050-N, TJmax = 125°C, and the typical thermal resistance (θJA), when board mounted, is 326°C/W for the SOT-23 package. 2 Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM4050-N LM4050-N-Q1 |
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