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BAT46WJ Datasheet(PDF) 8 Page - NXP Semiconductors |
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BAT46WJ Datasheet(HTML) 8 Page - NXP Semiconductors |
8 / 12 page BAT46WJ All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 8 November 2011 8 of 12 NXP Semiconductors BAT46WJ Single Schottky barrier diode 9. Package outline 10. Packing information [1] For further information and the availability of packing methods, see Section 14. 11. Soldering Fig 12. Package outline SOD323F (SC-90) 04-09-13 Dimensions in mm 0.80 0.65 0.25 0.10 0.5 0.3 2.7 2.3 1.8 1.6 0.40 0.25 1.35 1.15 1 2 Table 8. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number Package Description Packing quantity 3000 10000 BAT46WJ SOD323F 4 mm pitch, 8 mm tape and reel -115 -135 Reflow soldering is the only recommended soldering method. Fig 13. Reflow soldering footprint SOD323F (SC-90) 0.95 1.65 2.2 2.1 3.05 solder lands solder resist occupied area solder paste Dimensions in mm 0.5 (2 ×) 0.6 (2 ×) 0.6 (2 ×) 0.5 (2 ×) sod323f_fr |
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