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MMZ1608D241C Datasheet(PDF) 1 Page - TDK Electronics |
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MMZ1608D241C Datasheet(HTML) 1 Page - TDK Electronics |
1 / 6 page (1/6) 006-04 / 20061022 / e9412_mmz1608.fm • All specifications are subject to change without notice. Chip Beads(SMD) For Signal Line MMZ Series MMZ1608 Type FEATURES • Chip bead(impeder), MMZ series offers 6 construction materials. • Size standardized for use by automatic assembly equipment. No preferred orientation. • Either flow or reflow soldering methods can be used due to electroplating of the terminal electrodes. • High reliability due to an entirely monolithic structure. • Closed magnetic circuit structure allows high-density installation while preventing crosstalk between circuits. • Low DC resistance structure of electrode prevents wasteful electric power consumption. • The products contain no lead and also support lead-free soldering. • It is a product conforming to RoHS directive. APPLICATIONS Personal computers, CRTs, liquid crystal display panels, printers, hard disk drives, game machines, cellular phones, etc. PRODUCT IDENTIFICATION (1) Series name (2) Dimensions L × W (3) Material code (4) Nominal impedance 121:120 Ω at 100MHz (5) Characteristic type (6) Packaging style T:Taping HANDLING AND PRECAUTIONS • Before soldering, be sure to preheat components. The preheat- ing temperature should be set so that the temperature difference between the solder temperature and product temperature does not exceed 150°C. • After mounting components onto the printed circuit board, do not apply stress through board bending or mishandling. • The inductance value may change due to magnetic saturation if the current exceeds the rated maximum. • Do not expose the inductors to stray magnetic fields. • Avoid static electricity discharge during handling. • When hand soldering, apply the soldering iron to the printed cir- cuit board only. Temperature of the iron tip should not exceed 350°C. Soldering time should not exceed 3 seconds. MATERIAL CHARACTERISTICS B material: This type is perfectly suited for fast digital signals. By equalizing R components and X components that beads possess at a frequency of 5MHz, it is able to suppress overshooting, undershooting and ringing of fast digital signals. R material: For wide frequency applications calling for broad impedance characteristics. For digital signal line applications calling requiring good waveform integrity. Impedance values selected for effectiveness at 10 to 200MHz. S material: Standard type that features impedance characteristics similar to those of a typical ferrite core. For signal line applications in which the blocking region is near 100MHz. Impedance values selected for effec- tiveness at 40 to 300MHz. Y material: High frequency range type intended for the 100MHz region and above. For signal line applications in which the signal fre- quency is far from the cutoff frequency. Impedance val- ues selected for effectiveness at 80 to 400MHz. A material: This high-impedance product is based on the imped- ance frequency characteristics of our Y-material. The product offers excellent impedance characteristics, which is greater than 2500 Ω, in the vicinity of 100MHz range (MMZ1608A252B). D material: For applications calling for low insertion loss at low fre- quencies and sharply increasing impedance at high frequencies. Designed for high impedance at high fre- quencies (200 to 500MHz) for signal line applications. TYPICAL MATERIAL CHARACTERISTICS Conformity to RoHS Directive MMZ 1608 R 121 A T (1) (2) (3) (4) (5) (6) S B Y D 110 Frequency(MHz) 100 1000 10000 1000 100 10 1 R • Please contact our Sales office when your application are considered the following: The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.) • Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications. |
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