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TPS65150-Q1 Datasheet(PDF) 2 Page - Texas Instruments |
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TPS65150-Q1 Datasheet(HTML) 2 Page - Texas Instruments |
2 / 27 page TPS65150-Q1 SLVSBX4A – JUNE 2013 – REVISED SEPTEMBER 2013 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. DESCRIPTION (CONTINUED) One can also use the same internal circuit to provide a gate-shaping signal of VGH for the LCD panel controlled by the signal applied to the CTRL input. For highest safety, the TPS65150-Q1 has an integrated adjustable shutdown latch feature to allow application-specific flexibility. The device monitors the outputs (VS, VGL, VGH); and, as soon as one of the outputs falls below its power-good threshold, the device enters shutdown latch, after its adjustable delay time has passed by. ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range (unless otherwise noted) (1) UNIT Voltages on pin VIN(2) –0.3 V to 7 V Voltages on pin SUP –0.3 V to 15.5 V Voltage on pin SW 20 V Voltage on CTRL –0.3 V to 7 V Voltage on GD 15.5 V Voltage on CPI 32 V Operating junction temperature range –40°C to 125°C Storage temperature range –65°C to 150°C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values are with respect to network ground terminal. THERMAL INFORMATION TPS65150-Q1 THERMAL METRIC(1) PWP UNIT 24 PINS θJA Junction-to-ambient thermal resistance 40.6 θJCtop Junction-to-case (top) thermal resistance 20.8 θJB Junction-to-board thermal resistance 18.4 °C/W ψJT Junction-to-top characterization parameter 0.5 ψJB Junction-to-board characterization parameter 18.2 θJCbot Junction-to-case (bottom) thermal resistance 1.9 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. RECOMMENDED OPERATING CONDITIONS MIN TYP MAX UNIT VIN Input voltage range 1.8 6 V VS Output voltage range of the main boost converter VS 15 V L Inductor(1) 4.7 µH TA Operating ambient temperature –40 125 °C (1) Refer to application section for further information. 2 Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: TPS65150-Q1 |
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