Specifications are subject to change without notice.

The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.

Users should verify actual device performance in their specific applications.

Processing Information

Process Description

Materials

Temperature

Time Interval

1. Apply solder paste to test board

• Sn 96.5/Ag 3.0/Cu 0.5 Alloy

Room temperature

(8 - 10 mil thick)

water soluble or no clean solder

paste

• Single sided epoxy glass

(G10) (UL approved)

• PC board approx. 4x4x.06 in.

2. Place test units onto board

6 units/board

3. Ramp up

Convection oven

2.5 °C ±0.5 °/second

4. Preheat (TS)

150 °C to 190 °C

90 ±30 seconds

5. Time above liquidus (TL)

220 °C

60-90 seconds

6. Peak temperature (TP)

250 °C +0 °/-5 °

10-20 sec. within 5 °C of peak

7. Ramp down

Room temperature

3 °C ±0.5 °C/second

8. Cleaning water clean profile

High pressure deionized water

72 °F to 160 °F

As required

65 PSI maximum

(22 °C to 71 °C)

t 25 °C TO PEAK

TIME

tL

TP

TL

TS

MAX.

TS

MIN.

ts

PREHEAT

8 MINS./248.9 °C

RAMP-DOWN

CRITICAL ZONE

TL TO TP

RAMP-UP

tP