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RC0402FR-7D470KL Datasheet(PDF) 8 Page - YAGEO Corporation |
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RC0402FR-7D470KL Datasheet(HTML) 8 Page - YAGEO Corporation |
8 / 9 page Chip Resistor Surface Mount www.yageo.com Jan 05, 2011 V.6 Product specification 8 9 SERIES RC 0402 TEST TEST METHOD PROCEDURE REQUIREMENTS Intermittent Overload IEC 60115-1 4.39 2.5 times of rated voltage or maximum overload voltage whichever is less for 1 second on and 25 seconds off; total 10,000 cycles ±(1.0%+0.05 Ω) for 1% tol. ±(2.0%+0.05 Ω) for 5% tol. <100 mΩ for Jumper Solderability - Wetting IPC/JEDEC J-STD-002B test B Electrical Test not required Magnification 50X SMD conditions: 1st step: method B, aging 4 hours at 155 °C dry heat 2nd step: lead-free solder bath at 245±3 °C Dipping time: 3±0.5 seconds Well tinned (≥95% covered) No visible damage - Leaching IPC/JEDEC J-STD-002B test D Lead-free solder, 260 °C, 30 seconds immersion time No visible damage - Resistance to Soldering Heat IEC 60068-2-58 Condition B, no pre-heat of samples Lead-free solder, 260 °C, 10 seconds immersion time Procedure 2 for SMD: devices fluxed and cleaned with isopropanol ±(0.5%+0.05 Ω) for 1% tol. ±(1.0%+0.05 Ω) for 5% tol. <50 mΩ for Jumper No visible damage |
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