www.rovingnetworks.com

Version 3.2r 4/9/2012

9

RN -13 1-DS

Grounding Recommendations

For the module antenna to function, pins 36 through 44 must be connected to ground. Roving Networks suggests you

place the module such that 0.5 mm of theses pads is exposed. This placement provides access for soldering pins 36

through 44 from below, and provides ample clearance of the antenna from the PCB. See Figure 7.

Figure 7. Module Placement for Grounding

 

Solder Reflow

The solder reflow temperature must not exceed 220° C. To reflow solder the module onto a PCB, Roving Networks

recommends an RoHS-compliant solder paste equivalent to NIHON ALMIT paste or OMNIX OM-310 solder paste from

Alpha metals. See Table 6.

NOTE: Use no-clean flux and DO NOT water wash.

Table 6. Paste Solder Recommendations

Manufacturer

Alpha Metals

http://www.alphametals.com

NIHON ALMIT Co. LTD

http://almit.co.jp

Part Number

OMNIX OM-310

LFM-70W INP

Metal Composition

SAC305 (96.5% Sn, 3% Ag, 0.5% Cu)

88% Sn, 3.5% Ag, 0.5% Bi, 8% In

Liquidus Temperature

~220°C

~215°C

Figures 8 and 9 show the solder reflow temperature profiles.

RN-131

For Proper Antenna

Performance, Pins 36

Through 44 Must be

Grounded

8.5 mm

Bottom View

Motherboard

for RN-131