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T491T157K025AT Datasheet(PDF) 1 Page - Kemet Corporation |
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T491T157K025AT Datasheet(HTML) 1 Page - Kemet Corporation |
1 / 24 page © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com T2005_T491 • 10/8/2013 1 One world. One KEMET Benefits • Meets or exceeds EIA Standard 535BAAC • Taped and reeled per EIA 481–1 • Symmetrical, compliant terminations • Optional gold-plated terminations • Laser-marked case • 100% surge current test on C, D, E, U, V, X sizes • Halogen free epoxy • Capacitance 0.1 µF to 1,000 µF • Tolerance ±10%, ±20% • Voltage 2.5 – 50 VDC • Extended range values • Lowprofilecasesizes • RoHS Compliant and lead-free terminations (See www.kemet.com for transition information) • Operating temperature: -55ºC to +125ºC Applications Typicalapplicationsincludedecouplingandfilteringinindustrial and automotive end applications such as DC/DC converters, portable electronics, telecommunications, and control units. Overview TheKEMETT491Series,designedspecificallyfortoday’shighly automated surface mount processes and equipment, is the leading choice for surface mount designs. The T491 combines KEMET’sprovensolidtantalumtechnology,acclaimedand respected throughout the world, with the latest in materials, processes and automation, resulting in unsurpassed total performance and value. This product meets or exceeds the requirements of EIA Standard 535BAAC. The physical outline and dimensions of this series conformtothisglobalstandard.Fivelowprofilecasesizesare available in the T491 Series. The R/2012–12, S/3216–12 and T/3528–12 case sizes have a maximum height of 1.2 mm. The U/6032–15 size has a maximum height of 1.5 mm, and the V/7343–20 has a maximum height of 2.0 mm. The T491 standard terminations are 100% matte tin and provide excellent wetting characteristics and compatibility with today's surface mount solder systems. Tin/lead (Sn/Pb) terminations are available upon request for any part number. Gold-plated terminations are also available for use with conductive epoxy attachment processes. The symmetrical terminations offer total compliancy to provide the thermal and mechanical stress relief required with today's technology. Lead frame attachments to the tantalum pellet are made via a microprocessor-controlled welding operation, and a high temperature silver epoxy adhesive system. Standard packaging of these devices is tape and reel in accordance with EIA 481–1. This system provides perfect compatibility with all tape-fed placement units. Tantalum Surface Mount Capacitors – Standard Tantalum T491 Industrial Grade MnO 2 Series Environmental Compliance RoHS Compliant (6/6) according to Directive 2002/95/EC when ordered with 100% Sn solder. |
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