Product Bulletin

See Capacitance Value Chart below for thickness dimension.

+ For extended values 1210 case sizes - solder reflow only. (Refer to F3102 catalog for additional soldering information and recommendations.)

Outline Drawing

W

L

B

S

T

CONDUCTIVE METALLIZATION

ELECTRODES

TIN PLATE

NICKEL PLATE

Surface Mount Ceramic Chip Capacitors –

Ultra-High Capacitance, C0G Dielectric

© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com

F9200 11/07

EIA SIZE

CODE

METRIC

SIZE CODE

L - LENGTH

W - WIDTH

B - BANDWIDTH

S

SEPARATION

minimum

MOUNTING

TECHNIQUE

0402

1005

1.0 (.04) ± .05 (.002)

0.5 (.02) ± .05 (.002)

0.20 (.008) -.40 (.016)

0.3 (.012)

Solder Reflow

0603

1608

1.6 (.063) ± .15 (.006)

0.8 (.032) ± .15 (.006)

0.35 (.014) ± .15 (.006)

0.7 (.028)

Solder Wave +

or

Solder Reflow

0805

2012

2.0 (.079) ± .20 (.008)

1.25 (.049) ± .20 (.008)

0.50 (.02) ± .25 (.010)

0.75 (.030)

1206

3216

3.2 (.126) ± .20 (.008)

1.6 (.063) ± .20 (.008)

0.50 (.02) ± .25 (.010)

N/A

1210

3225

3.2 (.126) ± .20 (.008)

2.5 (.098) ± .20 (.008)

0.50 (.02) ± .25 (.010)

N/A

Dimensions - Millimeters (Inches)

C 0805

C

103

K

5

G

A

C

Style

C - Ceramic

Size Code

0402, 0603, 0805, 1206, 1210

Specification

C - Standard

Capacitance Code, pF

First two digits represent significant figures.

Third digit specifies number of zeros. 100 pF = 101.

(Use “9” for 1.0 through 9.9 pF)

(Use “8” for 0.1 through .99 pF)

Capacitance Tolerance

F = ±1%

K = ±10%

G = ±2%

M = ±20%

J = ±5%

Voltage

8 = 10V

5 = 50V

4 = 16V

1 = 100V

3 = 25V

Temperature Characteristic

Designated by Capacitance

Change Over Temperature Range

G = C0G (NP0) (±30 PPM/°C)

End Metallization

C = Standard (Tin-plate

nickel barrier)

Failure Rate Level

A = Not Applicable

Ordering Information