LM61

www.ti.com

SNIS121I – JUNE 1999 – REVISED FEBRUARY 2013

Typical Performance Characteristics

The LM61 in the SOT-23 package mounted to a printed circuit board as shown in Figure 14 was used to generate the

following thermal curves.

Thermal Resistance

Junction to Air

Thermal Time Constant

Figure 4.

Figure 5.

Thermal Response

Thermal Response in

in Stirred Oil Bath

Still Air with Heat Sink

with Heat Sink

Figure 6.

Figure 7.

Thermal Response in Still

Quiescent Current

Air without a Heat Sink

vs. Temperature

Figure 8.

Figure 9.

Copyright © 1999–2013, Texas Instruments Incorporated

Submit Documentation Feedback

5

Product Folder Links: LM61