MC74HCT573A

http://onsemi.com

8

PACKAGE DIMENSIONS

SOEIAJ−20

F SUFFIX

CASE 967−01

ISSUE A

DIM

MIN

MAX

MIN

MAX

INCHES

---

2.05

---

0.081

MILLIMETERS

0.05

0.20

0.002

0.008

0.35

0.50

0.014

0.020

0.15

0.25

0.006

0.010

12.35

12.80

0.486

0.504

5.10

5.45

0.201

0.215

1.27 BSC

0.050 BSC

7.40

8.20

0.291

0.323

0.50

0.85

0.020

0.033

1.10

1.50

0.043

0.059

0

0.70

0.90

0.028

0.035

---

0.81

---

0.032

0

NOTES:

1.

DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2.

CONTROLLING DIMENSION: MILLIMETER.

3.

DIMENSIONS D AND E DO NOT INCLUDE

MOLD FLASH OR PROTRUSIONS AND ARE

MEASURED AT THE PARTING LINE. MOLD FLASH

OR PROTRUSIONS SHALL NOT EXCEED 0.15

(0.006) PER SIDE.

4.

TERMINAL NUMBERS ARE SHOWN FOR

REFERENCE ONLY.

5.

THE LEAD WIDTH DIMENSION (b) DOES NOT

INCLUDE DAMBAR PROTRUSION. ALLOWABLE

DAMBAR PROTRUSION SHALL BE 0.08 (0.003)

TOTAL IN EXCESS OF THE LEAD WIDTH

DIMENSION AT MAXIMUM MATERIAL CONDITION.

DAMBAR CANNOT BE LOCATED ON THE LOWER

RADIUS OR THE FOOT. MINIMUM SPACE

BETWEEN PROTRUSIONS AND ADJACENT LEAD

TO BE 0.46 ( 0.018).

_

c

A

Z

D

E

20

110

11

b

M

0.13 (0.005)

e

0.10 (0.004)

VIEW P

DETAIL P

M

L

A

b

c

D

E

e

L

M

Z

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are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice

to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability

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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All

operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights

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MC74HCT573A/D

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