TSL230RD, TSL230ARD, TSL230BRD

PROGRAMMABLE LIGHT-TO-FREQUENCY CONVERTERS

TAOS054P − OCTOBER 2007

9

The LUMENOLOGY r Company

r

r

Copyright E 2007, TAOS Inc.

www.taosinc.com

MECHANICAL DATA

This SOIC package consists of an integrated circuit mounted on a lead frame and encapsulated with an electrically

nonconductive clear plastic compound. The TSL230RD has a 10

0.96 mm by 0.96 mm. The photodiodes are 0.084 mm

PACKAGE D

PLASTIC SMALL-OUTLINE

A

1.75

1.35

0.50

0.25

4.00

3.80

6.20

5.80

455

0.88 TYP TOP OF

SENSOR DIE

5.00

4.80

5.3

MAX

1.27

0.41

0.25

0.10

0.25

0.19

DETAIL A

PIN 1

6

0.510

0.330

8

y

j 2.8 TYP

CLEAR WINDOW

2.12

+ 0.250

3.00 + 0.250

NOTE B

Pb

PIN 1

TOP VIEW

BOTTOM VIEW

SIDE VIEW

END VIEW

NOTES: A. All linear dimensions are in millimeters.

B. The center of the 0.96-mm by 0.96-mm photo-active area is referenced to the upper left corner tip of the lead frame (Pin 1).

C. Package is molded with an electrically nonconductive clear plastic compound having an index of refraction of 1.55.

D. This drawing is subject to change without notice.

Figure 8. Package D — Plastic Small Outline IC Packaging Configuration