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AT27C400-12TI Datasheet(PDF) 2 Page - ATMEL Corporation

Part # AT27C400-12TI
Description  4-Megabit 256K x 16 or 512K x 8 OTP EPROM
Download  10 Pages
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Manufacturer  ATMEL [ATMEL Corporation]
Direct Link  http://www.atmel.com
Logo ATMEL - ATMEL Corporation

AT27C400-12TI Datasheet(HTML) 2 Page - ATMEL Corporation

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AT27C400
2
Description (Continued)
The AT27C400 can be organized as either word-wide or
byte-wide. The organization is selected via the BYTE/VPP
pin. When BYTE/VPP is asserted high (VIH), the word-wide
organization is selected and the O15/A-1 pin is used for
O15 data output. When BYTE/VPP is asserted low (VIL), the
byte-wide organization is selected and the O15/A-1 pin is
used for the address pin A-1. When the AT27C400 is logi-
cally regarded as x16 (word-wide), but read in the byte-
wide mode, then with A-1 = VIL the lower 8 bits of the 16-bit
word are selected and with A-1 = VIH the upper 8 bits of the
16-bit word are selected.
In read mode, the AT27C400 typically consumes 15 mA.
Standby mode supply current is typically less than 10
µA.
The A T 2 7 C4 00 i s a v ai la bl e i n i ndu s t r y s t and ar d
JEDEC-approved one-time programmable (OTP) PDIP,
SOIC (SOP), and TSOP packages. The device features
two-line control (CE, OE) to eliminate bus contention in
high-speed systems.
With high density 256K word or 512K byte storage capabil-
ity, the AT27C400 allows firmware to be stored reliably and
to be accessed by the system without the delays of mass
storage media.
Atmel’s AT27C400 has additional features that ensure high
quality and efficient production use. The RapidProgram-
ming Algorithm reduces the time required to program the
part and guarantees reliable programming. Programming
time is typically only 50
µs/word. The Integrated Product
Identification Code electronically identifies the device and
manufacturer. This feature is used by industry standard
programming equipment to select the proper programming
algorithms and voltages.
System Considerations
Switching between active and standby conditions via the
Chip Enable pin may produce transient voltage excursions.
Unless accommodated by the system design, these tran-
sients may exceed data sheet limits, resulting in device
non-conformance. At a minimum, a 0.1
µF high frequency,
low inherent inductance, ceramic capacitor should be uti-
lized for each device. This capacitor should be connected
between the VCC and Ground terminals of the device, as
close to the device as possible. Additionally, to stabilize the
supply voltage level on printed circuit boards with large
EPROM arrays, a 4.7
µF bulk electrolytic capacitor should
be utilized, again connected between the VCC and Ground
terminals. This capacitor should be positioned as close as
possible to the point where the power supply is connected
to the array.


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