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AT27C400-12TI Datasheet(PDF) 2 Page - ATMEL Corporation |
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AT27C400-12TI Datasheet(HTML) 2 Page - ATMEL Corporation |
2 / 10 page AT27C400 2 Description (Continued) The AT27C400 can be organized as either word-wide or byte-wide. The organization is selected via the BYTE/VPP pin. When BYTE/VPP is asserted high (VIH), the word-wide organization is selected and the O15/A-1 pin is used for O15 data output. When BYTE/VPP is asserted low (VIL), the byte-wide organization is selected and the O15/A-1 pin is used for the address pin A-1. When the AT27C400 is logi- cally regarded as x16 (word-wide), but read in the byte- wide mode, then with A-1 = VIL the lower 8 bits of the 16-bit word are selected and with A-1 = VIH the upper 8 bits of the 16-bit word are selected. In read mode, the AT27C400 typically consumes 15 mA. Standby mode supply current is typically less than 10 µA. The A T 2 7 C4 00 i s a v ai la bl e i n i ndu s t r y s t and ar d JEDEC-approved one-time programmable (OTP) PDIP, SOIC (SOP), and TSOP packages. The device features two-line control (CE, OE) to eliminate bus contention in high-speed systems. With high density 256K word or 512K byte storage capabil- ity, the AT27C400 allows firmware to be stored reliably and to be accessed by the system without the delays of mass storage media. Atmel’s AT27C400 has additional features that ensure high quality and efficient production use. The Rapid™ Program- ming Algorithm reduces the time required to program the part and guarantees reliable programming. Programming time is typically only 50 µs/word. The Integrated Product Identification Code electronically identifies the device and manufacturer. This feature is used by industry standard programming equipment to select the proper programming algorithms and voltages. System Considerations Switching between active and standby conditions via the Chip Enable pin may produce transient voltage excursions. Unless accommodated by the system design, these tran- sients may exceed data sheet limits, resulting in device non-conformance. At a minimum, a 0.1 µF high frequency, low inherent inductance, ceramic capacitor should be uti- lized for each device. This capacitor should be connected between the VCC and Ground terminals of the device, as close to the device as possible. Additionally, to stabilize the supply voltage level on printed circuit boards with large EPROM arrays, a 4.7 µF bulk electrolytic capacitor should be utilized, again connected between the VCC and Ground terminals. This capacitor should be positioned as close as possible to the point where the power supply is connected to the array. |
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Similar Description - AT27C400-12TI |
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