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AT27LV020A-12VI Datasheet(PDF) 2 Page - ATMEL Corporation

Part # AT27LV020A-12VI
Description  2 Megabit 256K x 8 Low Voltage OTP EPROM
Download  9 Pages
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Manufacturer  ATMEL [ATMEL Corporation]
Direct Link  http://www.atmel.com
Logo ATMEL - ATMEL Corporation

AT27LV020A-12VI Datasheet(HTML) 2 Page - ATMEL Corporation

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AT27LV020A
2
Atmel's innovative design techniques provide fast speeds
that rival 5V parts while keeping the low power consump-
tion of a 3V supply. At VCC = 3.0V, any byte can be
accessed in less than 90 ns. With a typical power dissipa-
tion of only 18 mW at 5 MH z and VCC = 3.3V, the
AT27LV020A consumes less than one fifth the power of a
standard 5V EPROM. Standby mode supply current is typi-
cally less than 1
µA at 3.3V.
The AT27LV020A is available in industry standard JEDEC
approved one-time programmable (OTP) plastic PLCC,
TSOP and VSOP packages. All devices feature two-line
control (CE, OE) to give designers the flexibility to prevent
bus contention.
The AT27LV020A operating with VCC at 3.0V produces
TTL level outputs that are compatible with standard TTL
logic devices operating at VCC = 5.0V. The device is also
capable of standard 5-volt operation making it ideally suited
for dual supply range systems or card products that are
pluggable in both 3-volt and 5-volt hosts.
Atmel's AT27LV020A has additional features to ensure
high quality and efficient production use. The RapidPro-
gramming Algorithm reduces the time required to program
the part and guarantees reliable programming. Program-
ming time is typically only 100
µs/byte. The Integrated
Product Identification Code electronically identifies the
device and manufacturer. This feature is used by industry
standard programming equipment to select the proper pro-
gramming algorithms and voltages. The AT27LV020A pro-
grams exactly the same way as a standard 5V AT27C020
and uses the same programming equipment.
System Considerations
Switching between active and standby conditions via the
Chip Enable pin may produce transient voltage excursions.
Unless accommodated by the system design, these tran-
sients may exceed data sheet limits, resulting in device
non-conformance. At a minimum, a 0.1
µF high frequency,
low inherent inductance, ceramic capacitor should be uti-
lized for each device. This capacitor should be connected
between the VCC and Ground terminals of the device, as
close to the device as possible. Additionally, to stabilize the
supply voltage level on printed circuit boards with large
EPROM arrays, a 4.7
µF bulk electrolytic capacitor should
be utilized, again connected between the VCC and Ground
terminals. This capacitor should be positioned as close as
possible to the point where the power supply is connected
to the array.


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