NCV8664

http://onsemi.com

11

Figure 28. qJA vs. Copper Spreader Area

Figure 29. Single−Pulse Heating Curves

PULSE TIME (sec)

0

100

200

300

400

500

600

700

0

20

40

60

80

100

120

140

160

SOT223

DPAK

SOIC−8 Fused

0.001

0.01

0.1

1

10

100

1000

0.000001

0.00001

0.0001

0.001

0.01

0.1

1

10

100

1000

SOIC−8 Fused

SOT223

DPAK

ORDERING INFORMATION

Device

Marking

Package

NCV8664D50R2G

V6645

SOIC−8 Fused

(Pb−Free)

2500 / Tape & Reel

NCV8664D50G

V6645

SOIC−8 Fused

(Pb−Free)

98 Units / Rail

NCV8664DT50RKG

V66450G

DPAK

(Pb−Free)

2500 / Tape & Reel

NCV8664DT33RKG

V66433G

DPAK

(Pb−Free)

2500 / Tape & Reel

NCV8664ST50T3G

V6645

SOT−223

(Pb−Free)

4000 / Tape & Reel

NCV8664ST33T3G

V6643

SOT−223

(Pb−Free)

4000 / Tape & Reel

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification

Brochure, BRD8011/D.