NTD3055-094T4G datasheet(1/9 Pages) ONSEMI

Part #	NTD3055-094T4G

Description	Power MOSFET 12 A, 60 V, N?묬hannel DPAK / IPAK

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Manufacturer	ONSEMI [ON Semiconductor]

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April, 2013 − Rev. 8

1

Publication Order Number:

NTD3055−094/D

NTD3055-094, NVD3055-094

Power MOSFET

12 A, 60 V, N−Channel DPAK / IPAK

Designed for low voltage, high speed switching applications in power

supplies, converters and power motor controls and bridge circuits.

Features

• Lower RDS(on)

• Lower VDS(on)

• Lower and Tighter VSD

• Lower Diode Reverse Recovery Time

• Lower Reverse Recovery Stored Charge

• NVD Prefix for Automotive and Other Applications Requiring

Unique Site and Control Change Requirements; AEC−Q101

Qualified and PPAP Capable

• These Devices are Pb−Free and are RoHS Compliant

Typical Applications

• Power Supplies

• Converters

• Power Motor Controls

• Bridge Circuits

MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)

Rating

Symbol

Value

Unit

Drain−to−Source Voltage

VDSS

60

Vdc

Drain−to−Gate Voltage (RGS = 10 MW)

VDGR

60

Vdc

Gate−to−Source Voltage

− Continuous

− Non−Repetitive (tpv10 ms)

VGS

"20

"30

Vdc

Drain Current

− Continuous @ TA = 25°C

− Continuous @ TA = 100°C

− Single Pulse (tpv10 ms)

ID

IDM

12

10

45

Adc

Apk

Total Power Dissipation @ TA = 25°C

Derate above 25°C

Total Power Dissipation @ TA = 25°C (Note 1)

Total Power Dissipation @ TA = 25°C (Note 2)

PD

48

0.32

2.1

1.5

W

W/°C

W

Operating and Storage Temperature Range

TJ, Tstg

−55 to

+175

°C

Single Pulse Drain−to−Source Avalanche

Energy − Starting TJ = 25°C

(VDD = 25 Vdc, VGS = 10 Vdc, L = 1.0 mH

IL(pk) = 11 A, VDS = 60 Vdc)

EAS

61

mJ

Thermal Resistance

− Junction−to−Case

− Junction−to−Ambient (Note 1)

− Junction−to−Ambient (Note 2)

RqJC

RqJA

3.13

71.4

100

°C/W

Maximum Lead Temperature for Soldering

Purposes, 1/8″ from case for 10 seconds

TL

260

°C

Stresses exceeding Maximum Ratings may damage the device. Maximum

Ratings are stress ratings only. Functional operation above the Recommen-

ded Operating Conditions is not implied. Extended exposure to stresses above

the Recommended Operating Conditions may affect device reliability.

1. When surface mounted to an FR4 board using 0.5 sq in. pad size.

2. When surface mounted to an FR4 board using the minimum recommended

pad size.

N−Channel

D

S

G

60 V

94 mW

RDS(on) TYP

12 A

ID MAX

V(BR)DSS

DPAK

CASE 369C

STYLE 2

MARKING

DIAGRAMS

1 2

3

4

IPAK

CASE 369D

STYLE 2

1

2

3

4

See detailed ordering and shipping information in the package

dimensions section on page 7 of this data sheet.

ORDERING INFORMATION

http://onsemi.com

1

Gate

3

Source

2

Drain

4

Drain

1

Gate

3

Source

2

Drain

4

Drain

55094 = Device Code

Y

= Year

WW

= Work Week

G

= Pb−Free Package

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